Toward Sub-20 nm Magnetic Tunnel Junction for Embedded Cache Memory

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In this paper, shrink process for small MTJs is investigated from the point of scalability. In the shrink process, various nitrogen or oxygen plasma treatments are done after the MTJ (CoFeB/MgO/CoFeB) etching. During this plasma treatment, the sidewall surface of the MTJ is modified, which results in the small electrical MTJ size of around 20 nm.Proposed techniques are scalable and promising for sub-20 nm MTJ generation in high density cache MRAM application.

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90-93

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October 2016

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© 2017 Trans Tech Publications Ltd. All Rights Reserved

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