Modelling Cu Diffusion into a Ta Barrier

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Periodical:

Defect and Diffusion Forum (Volumes 200-202)

Edited by:

D.J. Fisher

Pages:

219-224

DOI:

10.4028/www.scientific.net/DDF.200-202.219

Citation:

C. L. Liu "Modelling Cu Diffusion into a Ta Barrier", Defect and Diffusion Forum, Vols. 200-202, pp. 219-224, 2002

Online since:

November 2001

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$35.00

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