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HomeDefect and Diffusion ForumDefect and Diffusion Forum Vols. 200-202Modelling Cu Diffusion into a Ta Barrier

Modelling Cu Diffusion into a Ta Barrier

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Defects and Diffusion in Semiconductors IV

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Periodical:

Defect and Diffusion Forum (Volumes 200-202)

Pages:

219-224

DOI:

https://doi.org/10.4028/www.scientific.net/DDF.200-202.219

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Online since:

November 2001

Authors:

Chun Li Liu

Keywords:

Cross Diffusion, Vacancy Mechanism, Vacancy Sources

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© 2002 Trans Tech Publications Ltd. All Rights Reserved

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