Grain Boundary Surface Tension, Segregation and Diffusion in Cu-Sn System

Evgeny I. Gershman; Sergei Zhevnenko

doi:10.4028/www.scientific.net/DDF.264.39

Paper Titles

Investigating Interdiffusion in Mo/V Multilayers from X-Ray Scattering and Kinetic Simulations
p.13

Intermixing in Cu/Co: Molecular Dynamics Simulations and Auger Electron Spectroscopy Depth Profiling
p.19

Simultaneous Measurement of Tracer Jump Frequencies on Different Sublattices in Ga₇Pd₃ Using PAC
p.27

Dopant Diffusion during Amorphous Silicon Crystallization
p.33

Grain Boundary Surface Tension, Segregation and Diffusion in Cu-Sn System
p.39

The Stress Field in Cu-Fe-Ni Diffusion Couples
p.47

Effect of Morphology on the Mobility of Nanosized Liquid Pb Inclusions in Solid Al
p.55

Nonlinear Field Theory of the Stress Induced Interdiffusion and Mass Transport
p.63

Stress Evolution in Thin Films; Diffusion and Reactions
p.71

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Grain Boundary Surface Tension, Segregation and Diffusion in Cu-Sn System

Abstract:

Grain boundary and free surface tension for pure copper and copper-tin alloys are measured. On the base of these data isothermes of grain boundary tension, free surface tension and isothermes of adsorption are constructed in assumption of a dilute solution. Grain boundary diffusion coefficients of copper were calculated by using the relation of Borisov et. al. for copper and copper-tin alloys.

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Periodical:

Defect and Diffusion Forum (Volume 264)

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39-46

DOI:

https://doi.org/10.4028/www.scientific.net/DDF.264.39

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Online since:

April 2007

Authors:

Evgeny I. Gershman, Sergei Zhevnenko

Keywords:

Free Surface Tension, Grain Boundary Adsorption, Grain Boundary Diffusion, Grain Boundary Tension, Zero Creep Method

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