Grain Boundary Surface Tension, Segregation and Diffusion in Cu-Sn System

Abstract:

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Grain boundary and free surface tension for pure copper and copper-tin alloys are measured. On the base of these data isothermes of grain boundary tension, free surface tension and isothermes of adsorption are constructed in assumption of a dilute solution. Grain boundary diffusion coefficients of copper were calculated by using the relation of Borisov et. al. for copper and copper-tin alloys.

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Periodical:

Edited by:

D. L. Beke, Z. Erdélyi and I. A. Szabó

Pages:

39-46

DOI:

10.4028/www.scientific.net/DDF.264.39

Citation:

E. I. Gershman and S. N. Zhevnenko, " Grain Boundary Surface Tension, Segregation and Diffusion in Cu-Sn System ", Defect and Diffusion Forum, Vol. 264, pp. 39-46, 2007

Online since:

April 2007

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$35.00

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