Grain Boundary Surface Tension, Segregation and Diffusion in Cu-Sn System
Grain boundary and free surface tension for pure copper and copper-tin alloys are measured. On the base of these data isothermes of grain boundary tension, free surface tension and isothermes of adsorption are constructed in assumption of a dilute solution. Grain boundary diffusion coefficients of copper were calculated by using the relation of Borisov et. al. for copper and copper-tin alloys.
D. L. Beke, Z. Erdélyi and I. A. Szabó
E. I. Gershman and S. N. Zhevnenko, " Grain Boundary Surface Tension, Segregation and Diffusion in Cu-Sn System ", Defect and Diffusion Forum, Vol. 264, pp. 39-46, 2007