A Model and Simulated Analysis for Reliability and Failure in MEMS Fabrication

Abstract:

Engineering medical applications are enriched by the fabrication potential of the growing technology of Micro-Electro-Mechanical Systems (MEMS). Within this technological expansion, device manufacturing costs, failure and long-term performance reliability are critical issues that have to be resolved using basic probabilistic design methodologies which are yet largely unexploited by industrial and service companies at the mature innovation level. Modeling and testing of high-performance MEMS is a promising route, based upon these methodologies, to enhancing reliability and preventing surface failure. In this paper, we focus on the modeling of the mechanical properties of MEMS, as exemplified by a capacitive accelerometer, using probabilistic techniques. The accuracy of these techniques is also evaluated for the accelerometer with regard to those parameters that affect mainly reliability and failure. The simulated analysis of the mechanical properties is performed with easy-to-use probabilistic software known as “NESSUS”. It is concluded that probabilistic design methodologies are very effective and balanced for making design decisions that can, with both reliability and ease, ensure component or system efficiency.

• Periodical: Defect and Diffusion Forum (Volume 307)
• Pages: 93-102
• DOI: https://doi.org/10.4028/www.scientific.net/DDF.307.93
• Online since: December 2010
• Authors: M.Rizwan Malik, Tie Lin Shi, Zi Rong Tang, Shi Yuan Liu, M. Haseeb
• Keywords: Failure, MEMS Fabrication, Probability-Based Modeling, Reliability, Simulation

References

[1] N. Maluf, An introduction to microelectromechanical systems engineering, Artech House (2000).

[2] W. N. J. Sharpe, B. Yuan, R. Vaidyanathan and R. L. Edwards, Measurements of Young's modulus, Poisson's ratio, and tensile strength of polysilicon, Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS), 424-429 (1997).

DOI: 10.1109/memsys.1997.581881

[3] D. A. LaVan and T. E. Buchheit, Testing of critical features of polysilicon MEMS in de Boer, Materials Science of Microelectromechanical System (MEMS) Devices II, 19-24 (2000).

[4] A. A. Wereszczak, A. S. Barnes and K. Breder, Probabilistic strength of {111} n-type silicon, Journal of Materials Science: Materials in Electronics, 11 (2000) 291-303.

DOI: 10.1023/a:1008973231053

[5] K. -S. Chen, S. M. Spearing and N. N Nemeth, Structural design of a silicon micro-turbo-generator, AIAA, 39 (2001) 720-8.

DOI: 10.2514/2.1367

[6] L. Li, Microscale tension test of single crystalline silicon, Master thesis, University of California, Los Angeles (2001).

[7] M. A. Cesare and R. H. Sues, "Profes probabilistic finite element system - bringing probabilistic mechanics to the desktop, Structural Dynamics and Materials Conference, 4 (1999) 3040-50.

DOI: 10.2514/6.1999-1607

[8] A. Haldar and S. Mahadevan, Probability, reliability, and statistical methods in engineering design, John Wiley (2000).

[9] D. S. Riha, B. H. Thacker, H. R. Millwater, Y. -T. Wu and M. P. Enright, Probabilistic engineering analysis using the NESSUS software, Structural Dynamics, and Materials Conference and Exhibit, 1-12 (2000).

DOI: 10.2514/6.2000-1512

[10] P. D. Spanos and B. A. Zeldin, Monte Carlo treatment of random fields: a broad perspective, Applied Mechanics Review, 51 (1998) 219-37.

DOI: 10.1115/1.3098999

[11] B. H. Thacker, D. P. Nicolella, S. Kumaresan, N. Yoganandan and F. Pintar, Probabilistic finite element analysis of the cervical spine, Math. Modeling and Sci. Computing, 13 (2001) 12-21.

DOI: 10.1115/imece2000-2598

[12] A. Haldar and S. Mahadevan, Reliability assessment using stochastic finite element analysis, John Wiley & Sons (2000).

[13] B. Thacker and H. Millwater, NESSUS: A New Tool for Safer Structures, Southwest Research Institute (1991).

[14] M. -H. Bao, Micro mechanical transducers : pressure sensors, accelerometers, and gyroscopes, Elsevier (2000).

DOI: 10.1016/s1386-2766(00)80022-5

[15] B. Stark, MEMS reliability assurance guidelines for space application, Overview, Southwest Research Institute (2002).

[16] O. Kraft, R. Schwaiger and W. D. Nix, Measurement of mechanical properties in small dimensions by microbeam deflection, Materials Research Society Symposium - Proceedings, 518 (1998) 39-44.

DOI: 10.1557/proc-518-39

[17] N. N. Nemeth, J. L. Palko, C. A. Zorman, O. Jadaan and J. S. Mitchell, Structural modeling and probabilistic characterization of MEMS pressure sensor membranes, ANSYS, Inc. (2001).

[18] W. N. Sharpe, K. T. Turner and R. L. Edwards, Tensile testing of polysilicon, Experimental Mechanics, 39 (1999) 210-6.

[19] T. Yi and C. J. Kim, Measurement of mechanical properties for MEMS materials, Measurement Science & Technology, 10 (1999) 706-16.

[20] R. V. Lust and Y. T. J. Wu, Probabilistic structural analysis - An introduction, Experimental Techniques, 22 (1998) 29-32.