The Nature of Intrinsic Stresses in Thin Copper Condensates Deposited on Solid State Substrates

Abstract:

Size effect for intrinsic stresses and thermodynamics of films formation established taking into account the nature of stresses in copper condensates deposited on solid state substrates. We believe that surface energy changes during layer by layer deposition in such condensates with chaotically dispersed areas (possessing different values of Young’s modulus) define the film’s mechanic parameters. The quantitative estimations of mechanical stresses are calculated for layer by layer film growth. The resulting intrinsic stresses (ISs) in copper condensates nature from local static ones, superposed within the area of a film. The latter arose due to anisotropy of interface interaction energy parameters.

• Periodical: Journal of Nano Research (Volume 54)
• Pages: 66-74
• DOI: https://doi.org/10.4028/www.scientific.net/JNanoR.54.66
• Online since: August 2018
• Authors: Bohdan Koman, Olexiy A. Balitskii*, Volodymyr Yuzevych
• Keywords: Copper Condensates, Interface Interaction, Intrinsic Stresses, Young’s Modulus

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