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Key Engineering Materials Vols. 171-174

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.171-174

ToC:

Table of Contents

Paper Title Page

High Temperature Strengths of Ir-Based Refractory Superalloys
Authors: Yoko Yamabe-Mitarai, X. Yu, Y. Gu, Y. Ro, Shizuo Nakazawa, Tomohiro Maruko, Hiroshi Harada
625
Creep Behavior of Aluminum Alloy Foils for Microelectronic Circuits
Authors: Qing Zhou, Goroh Itoh
633
Creep and Evolution of Dynamic Recrystallization in Single Crystals of Ti-48at%Al with Different Orientation between Stress Axis and γ Lamellar Plate
Authors: N. Shiratori, S. Hirata, T. Asai, Masao Takeyama, T. Matsuo
639
Anomalous Creep Curve of Cu-30 Mass%Zn Alloy
Authors: A. Muto, Seishi Goto, M. Tagami
647
Deformation Mechanisms in Tin and Tin-Based Electronic Solder Alloys
Authors: M.D. Mathew, S. Movva, K.Linga Murty
655
Effect of Microalloying on the Creep Strength and Microstructure of Eutectic Sn-Pb Solders
Authors: Noboru Wade, T. Akuzawa, J. Kunii, K. Miyahara
663
Microstructures and Fracture Behaviours of Ir-Nb Two-Phase Refractory Superalloys Containing Various Amounts of Nb, Ni, Mo, C and B
Authors: Yue Feng Gu, Yoko Yamabe-Mitarai, Y. Ro, Hiroshi Harada
669
Investigation on Microstructure and Fracture of Quaternary Ir-Based Alloys
Authors: X.H. Yu, Yoko Yamabe-Mitarai, Y. Ro, Hiroshi Harada
677
Role of Interfacial Dislocations on Creep of a Fully Lamellar TiAl
Authors: T.G. Nieh, L.M. Hsiung
685
Microstructural Evolution Associated with Creep Rate Minima in Pure- and Near-γ TiAl Intermetallics
Authors: Antonín Dlouhý, K. Kuchařová, T. Horkel
693

Showing 81 to 90 of 111 Paper Titles

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