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HomeKey Engineering MaterialsKey Engineering Materials Vols. 238-239Development of a Polishing Disc Containing...

Development of a Polishing Disc Containing Granulated Fine Abrasives

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Advances in Abrasive Technology V

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Periodical:

Key Engineering Materials (Volumes 238-239)

Pages:

257-262

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.238-239.257

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Online since:

April 2003

Authors:

Hiroki Nakamura, Ji Wang Yan, Katsuo Syoji, Y. Wakamatsu

Keywords:

Fixed-Abrasive, Granulated Fine Abrasive, Polishing, Polishing Disc, Silicon Wafer

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© 2003 Trans Tech Publications Ltd. All Rights Reserved

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[1] Ceramics processing seminar: Precision processing of fine ceramics, Industrial Investigation Magazine, (1990) p.215.

[2] J. Ikeno: Fixed fine abrasive polishing of silicon wafer, Journal of the Japan Society for Grinding Engineering, Vol.44 (2000) p.433.

[3] H. Noguchi, Y. Abe, K. Tyou, T. Nakagawa: On the manufacture of fine grain silica wheel, Proceedings of the Japan Society for Precision Engineering 1994 Spring Meeting (1994) p.511.

[4] K. Tyou, H. Oguchi, T. Nakagawa: Mirror surface grinding by fine grain silica wheel, Proceedings of the Japan Society for Precision Engineering 1994 Spring Meeting (1994) p.513.

[5] Y. Nakano: Attraction of the gel form learned from the salmon roe, Journal of the Japan Society for Chemistry and Education, Vol.48 (2000) p.36. Fig.5 Relation between polishing time and finished surface roughness