Development of New Mica Abrasives Suitable for High Performance Mechanochemical Polishing of Si Wafers

Abstract:

Article Preview

Info:

Periodical:

Key Engineering Materials (Volumes 238-239)

Edited by:

Yongsheng Gao, Jun'ichi Tamaki and Koichi Kitajima

Pages:

253-256

DOI:

10.4028/www.scientific.net/KEM.238-239.253

Citation:

N. Yasunaga and S. Okada, "Development of New Mica Abrasives Suitable for High Performance Mechanochemical Polishing of Si Wafers", Key Engineering Materials, Vols. 238-239, pp. 253-256, 2003

Online since:

April 2003

Export:

Price:

$35.00

In order to see related information, you need to Login.