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HomeKey Engineering MaterialsKey Engineering Materials Vols. 238-239Kinematic Analysis of Chemical Mechanical...

Kinematic Analysis of Chemical Mechanical Polishing and its Effect on Polishing Results

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Advances in Abrasive Technology V

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Periodical:

Key Engineering Materials (Volumes 238-239)

Pages:

229-234

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.238-239.229

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Online since:

April 2003

Authors:

Hyoung Jae Kim, Ho Youn Kim, Hae Do Jeong, Sung Hoon Lee, David Dornfeld

Keywords:

CMP, Kinematical Analysis, Sliding Distance, Uniformity, Velocity Profile

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© 2003 Trans Tech Publications Ltd. All Rights Reserved

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[1] F. W. Preston, J. of the Society of Glass Technology, Vol.11(1927), No. 44, pp.227-228.

[2] H. Hocheng, H.Y. Tsai, M.S. Tsai, J. of Machine Tools & Manufacture, Vol. 40(2000), pp.1651-1669.

DOI: 10.1016/s0890-6955(00)00013-4

[3] C.F. Lin, W.T. Tseng and M.S. Feng, J. of Electrochem. Soc., Vol.146(1999), No. 5, pp.1984-1990.

[4] D. A. Hansen and G. Moloney, 6th International Chemical Mechanical Planarization for ULSI Multilevel Interconnect Conference(CMP-MIC), (2001), p.331.

[5] G.W. Stachowiak, A.W. Batchelor, Engineering Tribology, Tribology series24, Elsevier, NY, 1993, p.219.

[6] H.J. Kim, D.H. Kwon, H.D. Jeong, 7 th International Chemical Mechanical Planarization for ULSI Multilevel Interconnect Conference(CMP-MIC), (2002), pp.201-208.

[7] A. Modak, P. Monteith and N. Parekh, ibid, (1997), pp.169-172.

[8] S.K. Pangrle, I.Salugsugan, A. Dangca et. al. ibid, (1996), pp.47-54.