Kinematic Analysis of Chemical Mechanical Polishing and its Effect on Polishing Results

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Periodical:

Key Engineering Materials (Volumes 238-239)

Edited by:

Yongsheng Gao, Jun'ichi Tamaki and Koichi Kitajima

Pages:

229-234

Citation:

H. J. Kim et al., "Kinematic Analysis of Chemical Mechanical Polishing and its Effect on Polishing Results", Key Engineering Materials, Vols. 238-239, pp. 229-234, 2003

Online since:

April 2003

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[2] H. Hocheng, H.Y. Tsai, M.S. Tsai, J. of Machine Tools & Manufacture, Vol. 40(2000), pp.1651-1669.

[3] C.F. Lin, W.T. Tseng and M.S. Feng, J. of Electrochem. Soc., Vol. 146(1999), No. 5, p.1984-(1990).

[4] D. A. Hansen and G. Moloney, 6th International Chemical Mechanical Planarization for ULSI Multilevel Interconnect Conference(CMP-MIC), (2001), p.331.

[5] G.W. Stachowiak, A.W. Batchelor, Engineering Tribology, Tribology series24, Elsevier, NY, 1993, p.219.

[6] H.J. Kim, D.H. Kwon, H.D. Jeong, 7 th International Chemical Mechanical Planarization for ULSI Multilevel Interconnect Conference(CMP-MIC), (2002), pp.201-208.

[7] A. Modak, P. Monteith and N. Parekh, ibid, (1997), pp.169-172.

[8] S.K. Pangrle, I. Salugsugan, A. Dangca et. al. ibid, (1996), pp.47-54.