Key Engineering Materials
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Paper Title Page
Abstract: Thermal diffusivity of nonstoichiometric PrMnO3 and NdMnO3 phases were measured
by laser flash method from room temperature to 1100 K, in addition to the data of electrical
conductivity, thermal analysis and high temperature X-ray diffractometry to detect the phase
transition. The thermal diffusivity curve varied with increasing temperature and showed a clear
anomaly with a sudden dip at the phase transition temperature. The transition temperature decreases
with oxygen nonstoichiometry in each phase.
1695
Abstract: Polymer light emitting diodes (PLEDs) with ITO/PEDOT:PSS/MEH-PPV/LiF/Al
structures were prepared by spin coating method on the patterned ITO(indium tin oxide)/glass
substrates. MEH-PPV [Poly(2-methoxy-5(2-ethylhexoxy)-1,4-phenylenevinyle)] and PEDOT:PSS
[poly(3,4-ethylenedioxythiophene):poly(styrene sulfolnate)] polymers were used as the light
emitting and hole transport materials. The dependence of the plasma treatment of ITO anode films
on the optical and electrical properties of the PLEDs was investigated. The sheet resistances
increased with increasing the plasma intensities from 40W to 300W in RF power. In contrast, the
surface roughness was improved as the plasma intensity increased. The maximum current density
and luminance were found to be about 97.5 mA/ and 55 cd/m2 at 8 V for the PLED sample
coated on ITO/glass substrate with plasma treatment of 100W for 30s under 40 mtorr O2 pressure.
1699
Abstract: To fabricate a (110) silicon hard master, we used anisotropic wet etching. The etching
chemical for the silicon wafer was a TMAH 25% solution. We fabricated a 1x4 multimode planar
waveguide splitter using the silicon hard master. Organic-inorganic hybrid materials were used as
core and cladding layers of the planar waveguide splitter. The 15 μm-thick under-cladding layer
was coated on a silicon substrate and baked. After the core layer was coated on the under-cladding
layer, the core pattern was formed by using a hot embossing process at 100 °C and 1-3 kg/cm2. The
propagation loss of the planar waveguide was 0.4 dB/cm and the insertion loss of the 1x4 planar
waveguide splitter was 11.2 dB at the total splitter length of 3.5 cm.
1704
Abstract: A feasibility test for real-time fine particle measurements in vacuum semiconductor
processing equipment has been conducted. The approach in monitoring particles in process
equipment is an installation of a sensor at a critical location inside the process equipment (hence the
term ‘in-situ’) to track free particle levels in real-time. Common method for particle detection in a
process chamber today is a use of test wafer with a laser wafer scanner. However, this method does
not give a real time information of the particle status in the process chamber. In this paper, a new
method has been developed to detect particles in real time in vacuum system for particles smaller than
an optical method can detect. The system consists of a particle charging region and a particle detection
region in a vacuum system. Particles with 50nm are successfully detected at about 10 torr region.
1707
Abstract: In this paper, elastic moduli of nanostructured alumina are evaluated by simultaneous
measurement of longitudinal and shear wave velocities using mode-converted ultrasound in scanning
acoustic microscope (SAM). Mode-converted longitudinal and shear waves inside alumina sample
are captured to calculate acoustic wave velocities and determine elastic constants such as Young’s
modulus and Bulk modulus. Al2O3 nanostructured alumina samples are formed by compacting
micro-sized Al2O3 powder with nano-sized Al2O3 powder from 10wt% to 50wt%, and tested by SAM
to investigate elastic moduli. A correlation is found from experiment that the more percentage of
nano-particles are added, the higher elastic moduli are obtained. It is also shown that the
mode-converted ultrasound is sensitive enough to characterize mechanical modulus of nanostructured
alumina quantitatively.
1711
Abstract: Electron beam welding (EBW) has an important role in industrial applications such as
semi-conductor and LCD manufactures because of its high performance and accuracy. Since the
operation is done in a vacuum room, it is very difficult to test the weldability as well as the correct
welding area of the specimen. In this study, a measurement system of the EBW was developed based
on the 3-axis LVDT controlled table. In addition, the algorithm to tracking the welding line has been
developed. The weldability of the aluminum specimen was tested by a newly developed measurement
system with ultrasonic C-scan inspection.
1715
Abstract: The thermal fatigue properties of the solder joints with various underfills were evaluated
by thermal shock test. Flip chip package with electroless nickel-immersion gold plated on Cu pad of
FR-4 substrate and the Sn-37Pb solder ball was used. The thermal fatigue crack initiated at the
edges of interface between solder and silicon die. The fatigue property of package with underfill,
which has a higher glass transition temperature (Tg) and lower coefficient of thermal expansion
(CTE) value was better than that of package with underfill having a lower Tg and higher CTE.
1719
Abstract: In the present study, an investigation has been carried out on the friction stir welding
(FSW) of two magnesium alloys. Hot-rolled and Die-casting plates of AZ type magnesium alloys
were successfully joined by friction stir welding. AZ31B-H24 and AZ91C-F plates with the
thickness of 4mm were used, and the microstructural development in stir zone (SZ) was
investigated using optical and scanning electron microscopes. Hardness of SZ in AZ31B-H24 alloy
has been slightly decreased due to the coarse structure. On the other hand, Hardness of SZ in
AZ91C-F alloy has been remarkably increased due to very fine recrystallized grain structure. The
result of EPMA showed Al Solid solution hardening by Solid solution of β intermetallic compound
to α-Mg. While tensile strength of the FSWelded AZ31B-H24 alloy showed about 80% values
compare to Base metal, AZ91C-F showed about 68% values due to strongly affected by formation
of the intermetallic compounds, β-Al12Mg17.
1723
Abstract: The purpose of this study is to find out the method to detect AE signals at around the
notch tip and to evaluate the AE signal characteristics for the basemetal, PWHT(post weld heat
treatment) and weldment specimens of SA-516 steel during bend test. AE signals were produced in
the process of plastic deformation. AE signal strength and amplitude of the weldment was the
strongest, followed by PWHT specimen and basemetal. More AE signals were produced from the
weldment because of the oxides, and discontinuous mechanical properties. The stronger AE signal
strength, amplitude and more AE event counts for the weldment were shown.
1729
Abstract: Conventionally, shielded-metal arc welding (SMAW) process has been applied to join
pipes of reactor coolant loop, which caused defects and lot of loss in time and cost due to excessive
heat input in joining section. Recently, narrow-gap welding (NGW) process was introduced to
overcome the disadvantages of SMAW. However, the application of NGW to nuclear power plant is
not yet commonly used, because safety of NGW process is not fully proven. In the present paper,
welded coupons are made of stainless steel. They are manufactured under different processes; general
welding (GW), and repair welding after GW. Performed are various mechanical tests to investigate
microstructure, tensile strength and so on. It is verified that the mechanical properties of stainless steel
are slightly changed after repair welding process. It is also found from stress corrosion cracking tests
that the failure time of repair welding is shorter than that of general welding.
1733