Thermal Stress Analysis of MCM Package Using Diamond Material

Kuo Jun Xie; Chang Shun Jiang; Lin Zhu; Hai Feng Xu

doi:10.4028/www.scientific.net/KEM.353-358.2904

Paper Titles

Microstructure and Properties of Environmental-Friendly Sip/4032Al Composites Used for Electronic Packaging
p.2887

A Study on Failure Prediction of Airborne Electronic Equipment
p.2892

Study on the Service Life of Electronic Equipment
p.2896

Thermal Stress Distribution in the Corner of IC Package Structure
p.2900

Thermal Stress Analysis of MCM Package Using Diamond Material
p.2904

Torsional Fatigue of 63Sn-37Pb and Sn-0.7Cu Solders
p.2908

Research on Creep Properties of Sn2.5Ag0.7CuXRE Lead-Free Soldered Joints for Surface Mount Technology
p.2912

In Situ Thermal-Mechanical Fatigue Testing of Thin Au Lines
p.2916

Theoretical Analysis of Young’s Modulus and Dielectric Constant for Low-k Porous Silicon Dioxide Films
p.2920

HomeKey Engineering MaterialsKey Engineering Materials Vols. 353-358Thermal Stress Analysis of MCM Package Using...

Thermal Stress Analysis of MCM Package Using Diamond Material

Abstract:

With the increasing of packaging integration the power and the quantity of heat of integrate circuit will increase, it will bring more and more temperature distributions and problems about thermal stresses in package. In this paper a finite element thermal stress model of substrate-adhesive-chip is established, thermal stress distribution of substrate-chip interfaces and the affects of geometrical structure on thermal stresses are analyzed by finite element method, especially discuss interfacial thermal stresses distributions on chip-adhesive interface and adhesinve-substrate interface.

You might also be interested in these eBooks

Progresses in Fracture and Strength of Materials and Structures

View Preview

Info:

Periodical:

Key Engineering Materials (Volumes 353-358)

Pages:

2904-2907

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.353-358.2904

Citation:

Cite this paper

Online since:

September 2007

Authors:

Kuo Jun Xie, Chang Shun Jiang, Lin Zhu, Hai Feng Xu

Keywords:

Diamond Substrate, Finite Element Model (FEM), Thermal Stress

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

Citation:

References

[1] Yujun Wen and Cemal Basaran: An Analytical Model for Thermal Stress Analysis of Multi-layered Microelectronics Packaging, 2004 Electronic Components and Technology Conference (2004), pp.1592-1601.

DOI: 10.1109/ectc.2004.1320328

Google Scholar

[2] Jones, R.E., M.L. and Basehore: Stress analysis of encapsulated fine-line aluminium interconnect Appl. Phys. Lett. Vol. 50(1987), pp.725-721.

DOI: 10.1063/1.98263

Google Scholar