Thermal Stress Analysis of MCM Package Using Diamond Material


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With the increasing of packaging integration the power and the quantity of heat of integrate circuit will increase, it will bring more and more temperature distributions and problems about thermal stresses in package. In this paper a finite element thermal stress model of substrate-adhesive-chip is established, thermal stress distribution of substrate-chip interfaces and the affects of geometrical structure on thermal stresses are analyzed by finite element method, especially discuss interfacial thermal stresses distributions on chip-adhesive interface and adhesinve-substrate interface.



Key Engineering Materials (Volumes 353-358)

Edited by:

Yu Zhou, Shan-Tung Tu and Xishan Xie




K. J. Xie et al., "Thermal Stress Analysis of MCM Package Using Diamond Material", Key Engineering Materials, Vols. 353-358, pp. 2904-2907, 2007

Online since:

September 2007




[1] Yujun Wen and Cemal Basaran: An Analytical Model for Thermal Stress Analysis of Multi-layered Microelectronics Packaging, 2004 Electronic Components and Technology Conference (2004), pp.1592-1601.

DOI: 10.1109/ectc.2004.1320328

[2] Jones, R.E., M.L. and Basehore: Stress analysis of encapsulated fine-line aluminium interconnect Appl. Phys. Lett. Vol. 50(1987), pp.725-721.

DOI: 10.1063/1.98263

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