Chip-Level Active Temperature Control for Improving Temperature Robust of a Micro-Gyroscope

Zhi Hua Chen; Le Le Liu; Ding Bang Xiao; Hong Juan Cui; Xing Hua Wang

doi:10.4028/www.scientific.net/KEM.645-646.600

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HomeKey Engineering MaterialsKey Engineering Materials Vols. 645-646Chip-Level Active Temperature Control for...

Chip-Level Active Temperature Control for Improving Temperature Robust of a Micro-Gyroscope

Abstract:

Silicon micro-fabricated gyroscope are very sensitive to ambient temperature, this paper conducted a novel active temperature controlling system. Combined with the PTC thermistor to detect internal temperature and the inserted TEC to control the temperature, encapsulation condition inside the gyroscope was kept in a stable situation. Experimental results showed that it greatly improved the performance of the micro-gyroscope.

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Periodical:

Key Engineering Materials (Volumes 645-646)

Pages:

600-604

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.645-646.600

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Online since:

May 2015

Authors:

Zhi Hua Chen, Le Le Liu*, Ding Bang Xiao, Hong Juan Cui, Xing Hua Wang

Keywords:

Butterfly Gyroscope, Temperature Control, Zero-Rate Output

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* - Corresponding Author

References

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