The SOI Micro-Accelerometer Fabricated by Sacrificial Process

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This paper presents the fabricationof SOI micro-accelerometer by using the sacrificial process. The structure ofthe SOI micro-accelerometer is designed and analyzed by the finite element modeling.As for the fabrication issue, the problem of electrode metal layer to standagainst HF etching is first studied. Second, to prevent the over-etching of theBOX layer during structure releasing process, the etching rate of the BOX layeris carefully investigated and an optimal etching duration is obtained. Third,the adhesion phenomenon between comb fingers during releasing process isstudied and optimized finger geometry is proposed to solve such problem.Devices based on the sacrificial process is carried out successfully, themeasurement results show that the sensitivity of the accelerometer is about 35mV/g, with a maximal measurement error of 12mg, and a maximal nonlinear error of0.41% within 50g.

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Key Engineering Materials (Volumes 645-646)

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616-623

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May 2015

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© 2015 Trans Tech Publications Ltd. All Rights Reserved

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[1] Yoshiyuki Watanabe; Toshiaki Mitsui; Takashi Mineta, etal. SOI micromachined 5-axis motion sensor using resonant electrostatic drive and non-resonant capacitive detection mode. Sensors and Actuators A: Physical,130 /131(2006), 116-123.

DOI: 10.1016/j.sna.2005.11.055

Google Scholar

[2] Chen T D; Kelly T W; Collins D, et al. The next generation integrated MEMS and CMOS process on SOI wafers for overdamped accelerometers. The 13th International Conference on Solid-State Sensors,Actuators and Microsystems. Seoul,Korea,2005; pp.1123-1125.

DOI: 10.1109/sensor.2005.1497273

Google Scholar

[3] Amini B V; Pourkamali S; Ayazi F. A high resolution, stictionless, CMOS compatible SOI accelerometer with alow noise, low power,0. 25 μm CMOS interface. Proceedings of 17th IEEE International Conference on MEMS. 2004, 572-575.

DOI: 10.1109/mems.2004.1290649

Google Scholar

[4] Qu X D; Xie H K. Process development for CMOS MEMS sensors with robust electrically isolated bulk silicon microstructures. IEEE J Microelectromechanical Sys,2007,4, 1152-1161.

DOI: 10.1109/jmems.2007.906079

Google Scholar

[5] MAO Xu, YANG Z C, et al. SOI Micro-accelerometer fabrication with anti-footing technique. Nanotechnology and Precision Engineering, 2010, 4, 330-334.

Google Scholar

[6] Zhang Zhaoyun; Shi Zhigui; GaoYang, et al. Study of the Corrosive Property of Metal Electrode. Chinese Journal of Sensors and Actuators,2012,3, 326-328.

Google Scholar

[7] C. Linder and N.J. deRooij. Investigation on free-standing polysilicon beams in view of their application as transducers, sensors and actuators A, 1990, 21-A23, 1053-1059.

DOI: 10.1016/0924-4247(90)87088-z

Google Scholar

[8] K.S.J. Pister. Hinged polysiliconstructures with integrated CMOS TFT'S. Proc. IEEE Solid-State Sensor and Actuator Workshop, Hiton Head Island, SC, USA, 22-25 June, 1992, 136-139.

DOI: 10.1109/solsen.1992.228307

Google Scholar