Brazing of Copper Foam Using Cu-4.0Sn-9.9Ni-7.8P Filler Foil: Effect of Brazing Temperature and Copper Foam Pore Density

Article Preview

Abstract:

Copper (Cu) foam is a promising material that owns a high surface area that can be utilized in a thermal application. In this research, the brazing of Cu substrate to Cu foam in the sandwich configuration using Cu alloy filler foil was carried out. The foam at different pore per inch (PPI) of 15, 25 and 50 are brazed at different brazing temperatures. Mechanical and microstructure analysis were conducted to investigate a suitable brazing temperature and the best pore density of foam. The compressive strength of brazed 50 PPI foam has yielded the highest due to the highly dense interconnected branches. While the highest shear strength of brazed interface using 15 PPI foam has been recorded. The large branch size of 15 PPI foam has contributed to the sound joint between the brazed joint interface of Cu substrate and foam. Both mechanicals analysis above exhibits a highest strength at 660 °C as a brazing temperature The shear stress-strain curve of Cu substrate and foam brazed joint interface shows a brittle behaviour which accordance with the discoverable brittle phases of Cu3P and Ni3P using X-ray diffraction (XRD). Scanning electron microscopy (SEM) and Energy dispersive X-ray spectroscopy (EDX) have presented the formation of Cu3P and Ni3P at the brazed joint interface of Cu substrate and foam.

You might also be interested in these eBooks

Info:

Periodical:

Pages:

67-76

Citation:

Online since:

July 2024

Export:

Price:

Permissions CCC:

Permissions PLS:

Сopyright:

© 2024 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

* - Corresponding Author

[1] R. Chein, H. Yang, T. Tsai, C. Lu: submitted to Microsystem Technologies (2009)

Google Scholar

[2] W.C. Tan, K.K. Chong: submitted to Applied Thermal Engineering (2016)

Google Scholar

[3] Y. Zhang, E. Long, M. Zhang: submitted to Materials Today: Proceedings (2018)

Google Scholar

[4] M.N. Feng, Y. Xie, C. Zhao, Z. Luo: submitted to Journal Manufacturing Processes (2018)

Google Scholar

[5] Y. Huang, J. Gong, S. Lv, J. Leng, Y. Li: submitted to Material Science Engineering A (2012)

Google Scholar

[6] N.H. Jamadon, A.W. Tan, F. Yusof, T. Ariga, Y. Miyashita, H. Hamdi: submitted to Metals (2016)

Google Scholar

[7] C.A. Biffi, D. Colombo, A. Tuissi: submitted to Optics Laser in Engineering (2014)

Google Scholar

[8] H. Heo, G. Kim, D. Yeon, C. Moon, K. Chun: submitted to Material Science & Engineering A (2019)

Google Scholar

[9] H. Zhang, L. Chen, Y. Liu, Y. Li: submitted to International Journal of Heat and Mass Transfer (2013)

Google Scholar

[10] S. Mancin, A. Diani, L. Doretti, L. Rossetto: submitted to (2014)

Google Scholar

[11] C. Wang, T. Lin, N. Li, H. Zheng: submitted to Renewable Energy (2016)

Google Scholar

[12] R. Rybar, M. Beer, D. Kudelas, B. Pandula: submitted to Metalurgica (2016)

Google Scholar

[13] Y. Liu, H.F. Chen, H.W. Zhang, Y.X. Li: submitted to International Journal of Heat and Mass Transfer (2015)

Google Scholar

[14] S-De Schampheleire, P-De Jaeger, K-De Kerpel, B. Ameel, M-De Paepe: submitted to Procedia Material Science (2014)

DOI: 10.1016/j.mspro.2014.07.574

Google Scholar

[15] A. Hamadouche, R. Nebbali, H. Benahmed, A. Kouidri, A. Bousri: submitted to Experimental Thermal and Fluid Science (2016)

DOI: 10.1016/j.expthermflusci.2015.10.009

Google Scholar

[16] N. Tsolas, S. Chandra: submitted to Journal of Heat Transfer (2012)

Google Scholar

[17] A.A. Shirzadi, Y. Zhu, H.K.D.H. Bhadeshia: submitted to Materials Science and Engineering A (2008)

Google Scholar

[18] J.H. Lin, D.L. Luo, S.L. Chen, D.S. Mao, Z.Y. Wang, Q. Ma, J. Lei: submitted to Ceramics International (2016)

Google Scholar

[19] W. Guo, H. Zhang, K. Ma, Y. Zhu, H. Zhang, B. Qi, F. Li: submitted to Ceramics International (2019)

Google Scholar

[20] Z. Wang, G. Wang, M. Li, J. Lin, Q. Ma, A. Zhang, J. Feng submitted to Carbon (2017)

Google Scholar

[21] X. Wang, C. Li, X. Si, J. Qi, J. Feng, J. Cao: submitted to Vacuum (2018)

Google Scholar

[22] T. Jarvis, W. Voice, R. Goodall: submitted to Material Science Engineering A (2011)

Google Scholar

[23] C. Nannan, C. Jie, L. Bin, C. Fanyan: submitted to Materials and Engineering (2013)

Google Scholar

[24] Y.F. Song, L.R. Xiao, X.J. Zhao, H. Zhou, W. Zhang, L. Guo, Y.H. Wang: submitted to Materials and Manufacturing Processes (2016)

Google Scholar

[25] T. Zaharinie, Z. Huda, M. F. Izuan, M. Hamdi: submitted to Applied Surface Science (2015)

Google Scholar

[26] N.A.M. Zahri, F. Yusof, T. Ariga, A.S.M.A. Haseeb, M.A. Mansoor, N.L. Sukiman: submitted to Material Science Technology (2019)

Google Scholar

[27] Z. Zhong, J. Zhou, X. Shen, X. Ling: submitted to Welding Journal (2012)

Google Scholar

[28] A. Hasap, N. Noraphaiphipaksa, C. Kanchanomai, M.N. Feng, Y. Xie, C. Zhao, Z. Luo: submitted to Welding Journal (2014)

Google Scholar

[29] A.M. Aminazad, A.M. Hadian, F. Ghasimakbari: submitted to Procedia Materials Science (2015)

Google Scholar

[30] M. Lutfi, F. Yusof, T. Ariga, R. Singh, A.S.M. Hamdi: submitted to Key Engineering Materials (2016)

Google Scholar