Key Engineering Materials Vol. 984

Abstract: Color centers in 4H-SiC and diamond are candidates for single photon sources and qubits for the implementation of quantum applications. The CI-cRPA method is able to correctly reproduce the structure of the underlying highly correlated wave functions for low and high spin multiplets. Aiming for a more complete understanding of spin-orbit mediated intersystem crossing between such states, we have extended CI-cRPA by a first order treatment of the spin-orbit interactions. We present preliminary results for intercrossing matrix elements and contributions of spin-orbit coupling to the zero field splitting of the silicon vacancy and di-vacancy in 4H-SiC, as well as the NV center in diamond using this approach.

Abstract: Color centers in the technologically mature material silicon carbide are candidates for the implementation of quantum applications. Chargestate control and electrical read-out of qubits includes spin-to-charge conversion via optical excitation and subsequent ionization. In this work we address the dominant photoionization mechanism and the photophysical properties of the ionized silicon vacancy in 4H SiC using ab initio theory. We find that its nominally dark chargestates are infrared emitters.

Abstract: The thermochromic properties (color change with temperature) of n type doped SiC wafers of different polytypes (3C, 4H and 6H) have been investigated up to 500°C under air. It was found that 3C-SiC color passes from bright yellow at room temperature to deep orangeat 500°C leading to a color contrast (ΔE) as high as 64. The hexagonal polytypes undergo also a color change upon heating but far less pronounced, with ΔE values <20. All these semiconductors undergo band gap shrinkage upon heating which effect largely participated to the observed color change. This effect is very sensitive for 3C polytypesince its bandgap is already in the visible energy range at room temperature. The thermochromicity of 3C-SiC was found to be reversible thanks to its thermal stability and its resistance towards oxidation.

Abstract: The properties of graphene chips with low reproducibility (LR) after photolithography (PLG) and graphene functionalization have been studied. It is shown that the introduction of additional cleaning after PLG can significantly increase the reproducibility of the parameters of processed graphene in biosensors. The use of dilute PBS solutions for virus detection makes it possible to increase the relative concentration sensitivity of biosensors by several times.

Abstract: In this work, the fabrication of wafer-level vacuum packaged 3C-SiC resonators obtained from layers grown on <100> and <111> silicon is reported. The resonant microstructures are double-clamped beams encapsulated by glass-silicon anodic bonding using titanium-based vacuum gettering. Open-loop resonance frequency measurements are performed on the vacuum-packaged devices showing Q-factor values up to 292,000 for <100> and 331,000 for <111> substrates, with a maximum vacuum level around 10^-2 mbar inside the encapsulations with Ti getter.

Abstract: Solid State Detectors (SSD) are crucial for fast neutron detection and spectroscopy in tokamaks due to their solid structure, neutron-gamma discrimination, and magnetic field resistance. They provide high energy resolutions without external conversion stages, enabling compact array installations in the harsh environment of a tokamak. Research comparing diamond and 4H-SiC detectors highlights thickness as a key efficiency factor. A 250 μm SiC epilayer with low doping, grown using a high-growth-rate process, exhibits sharp interfaces and minimal defects, essential for neutron detectors. The study evaluates detector designs, and performance using a 4H-SiC substrate. Various detector designs, such as Schottky diodes and p/n diodes, are assessed via I-V and C-V measurements, addressing high depletion voltage challenges. Preliminary neutron irradiation tests validate detector functionality, energy resolution and confirming detector reliability.

Abstract: In this paper the stress field distribution in 3C-SiC (111) resonators has been studied by micro-Raman measurements and COMSOL simulations. The measurements show that the asymmetry of the anchor points configuration produce an asymmetry in the stress filed distribution. This behavior has been confirmed also by the simulations. Furthermore, from the simulations the importance of the reduction of the under etching of the anchor points of the resonators has also been observed. In fact the reduction of this under etch produces a decrease of the stress in the double clamped beams, a small reduction of the resonance frequency, and a large reduction of the Q-factor and then of the oscillation frequency stability of the resonators in closed-loop operation.

Abstract: In this paper we study and compare two designs of a temperature sensor monolithically integrated to a vertical SiC JFET. One sensor utilizes the standard JFET P+ aluminum gate implantation scheme. The advantage of this sensor is that the integration with a JFET process flow can be achieved with no additional process steps or mask layers. The other sensor uses a combination P-body and a low energy P+ implantation scheme, typically seen in MOSFETs. Both sensors exploit the variation of resistance with temperature of Al doped SiC. Drift-Diffusion simulations of both designs are carried out at fixed temperatures, exhibiting an excellent ~53% relative reduction in sensor resistance from 300 to 450K. However, neither design shows linear behavior with temperature, beginning to saturate at 450K. Electrothermal simulations are also deployed to verify the sensor robustness as the sensor is locate relatively far from the JFET junction. Due to the high thermal conductivity of SiC, the sensor average temperature follows closely the junction temperature. Current crowding (or 2D effects) close to the contact edges is observed in both sensors. We also deploy a simple analytical model to calculate the resistance as a function of the temperature for both sensors. The model agrees with the drift-diffusion calculations, however due to the 2D nature of current flow, a maximum 19.6% relative error is obtained. In general, both sensors deployed similar relative sensitivity, however the P-body sensor resistance changes in a range of 10.6kΩ to 4.95kΩ compared to 700Ω to 330Ω for the P+ sensor.

Abstract: A numerical model is presented for the simulation of ultraviolet ion-implanted 4H-SiC photodiodes with shallow p^- emitter doping profiles. An existing model for SiC pin photodiodes, taken from literature, is modified with a dedicated SiO₂-SiC interface layer to account for degradation of carrier mobility and lifetime at the interface. Furthermore, aluminum compensation in 4H-SiC is included and its impact on the spectral response and carrier recombination is analyzed. The simulated spectral response in the wavelength range from 200 to 400 nm is compared to experimental data. While the existing model, taken from literature, fails to predict the performance of VUV photodiodes with a shallow p^- emitter, the newly designed model successfully achieves high accuracy, even with a basic modeling approach featuring an abrupt material parameter transition.