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HomeKey Engineering MaterialsKey Engineering Materials Vol. 984Device Modeling of 4H-SiC PIN Photodiodes with...

Device Modeling of 4H-SiC PIN Photodiodes with Shallow Implanted Al Emitters for VUV Sensor Applications

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Abstract:

A numerical model is presented for the simulation of ultraviolet ion-implanted 4H-SiC photodiodes with shallow p^- emitter doping profiles. An existing model for SiC pin photodiodes, taken from literature, is modified with a dedicated SiO₂-SiC interface layer to account for degradation of carrier mobility and lifetime at the interface. Furthermore, aluminum compensation in 4H-SiC is included and its impact on the spectral response and carrier recombination is analyzed. The simulated spectral response in the wavelength range from 200 to 400 nm is compared to experimental data. While the existing model, taken from literature, fails to predict the performance of VUV photodiodes with a shallow p^- emitter, the newly designed model successfully achieves high accuracy, even with a basic modeling approach featuring an abrupt material parameter transition.

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Periodical:

Key Engineering Materials (Volume 984)

Pages:

55-62

DOI:

https://doi.org/10.4028/p-T0xLa9

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Cite this paper

Online since:

August 2024

Authors:

Michael Schraml*, Mathias Rommel, Niklas Papathanasiou, Johann Tobias Erlbacher

Keywords:

Numerical Simulation, Photodiode, Photoresponsivity, Shallow Ion-Implantation, Vacuum UV

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Creative Commons CC BY 4.0

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* - Corresponding Author

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