Preparation and Properties of Modified Boron Nitride/Epoxy Resin Thermal Conductive Composites

Abstract:

Boron nitride (BN) was modified by silane coupling agent (KH560) and used as heat conductive filler to prepare the modified BN (BN560)/epoxy composite. The effect of the BN560 filler content on the thermal conductivity and thermal stability of the epoxy composite was studied. The results show that BN560 can be uniformly dispersed in the epoxy matrix by an ultrasonic disperser. The BN560 added can effectively improve the thermal conductivity of the epoxy composite. With the increase of BN560 content to 20 wt.%, the thermal conductivity of the composite increases accordingly to 0.27 W/(m·K), 50% higher than that of pure epoxy, and a heat conductive network is formed. The BN560 added can improve the thermal stability of the composite. With increasing BN560 content, the thermal decomposition temperature and glass transition temperature of the composite increase. The composite with the BN560 content of 20 wt.% has the weight loss of 10 wt.% at 395.12 °C and the glass transition temperature of 144.59 °C.

• Periodical: Materials Science Forum (Volume 1003)
• Pages: 173-178
• DOI: https://doi.org/10.4028/www.scientific.net/MSF.1003.173
• Online since: July 2020
• Authors: Chen Liu, Hao Ran Zhou*, Zhen Yuan
• Keywords: Boron Nitride, Epoxy Resin, Thermal Conductivity, Thermal Stability

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