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Pd-Based Ohmic Contacts to LPE 4H-SiC with Improved Thermal Stability

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Periodical:

Materials Science Forum (Volumes 433-436)

Pages:

713-716

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.433-436.713

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Online since:

September 2003

Authors:

L. Kassamakova-Kolaklieva, Roumen Kakanakov, Volker Cimalla, N. Hristeva, G. Lepoeva, N.I. Kuznetsov, Konstantinos Zekentes

Keywords:

Device Reliability, Ohmic Contact, Surface Morphology, Thermal Stability

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© 2003 Trans Tech Publications Ltd. All Rights Reserved

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