Progress on Advanced Manufacture for Micro/Nano Technology 2005

Volumes 505-507

doi: 10.4028/www.scientific.net/MSF.505-507

Paper Title Page

Authors: Yeong Maw Hwang, Chi Yu Wu, Ging Ian Shin

Abstract: In this study, elastic buckling criteria for die fins during extrusion of complex-shaped parts are analytically derived. In this analytical...

1081
Authors: Yi Chih Hsieh

Abstract: A structured light pattern can be used to acquire the range data of an object from a single camera for 3-D imaging systems and it can be...

1087
Authors: Ming Horng Su, Hung Chang Chen

Abstract: This paper studies the phase transitions of Cu and Ni alloys as they cool from melting temperature to room temperature under high-pressure...

1093
Authors: Tzung Han Lin

Abstract: In this paper, a method for determining the approximated minimum-bounding box is presented. This method can only be used in the model that...

1099
Authors: Chin Ru Su, Cha'o Kuang Chen

Abstract: The contour of a two dimensional plate with a rectangular cavity was predicted by the linear least-squares error method. In the analysis...

1105
Authors: Min Jou, Han Wei Zhang

Abstract: Manufacturing engineering education is science & technology based subjects that are traditionally the hardest to teach online because of the...

1111
Authors: Kai Ying Chen

Abstract: Manufacturing execution system (MES) is a computer application system that integrates all relevant real-time information along every step in...

1117
Authors: Chung Hsien Kuo, M.D. Jeng, J.J. Wing, Tai Hong Wang

Abstract: The surface mounting of electronic component is the major manufacturing technology for the electronic products in the last decade. The...

1123
Authors: Da Yin Liao

Abstract: During design and implementation of the automatic materials handling system (AMHS) for a local 300mm semiconductor wafer fab (semiconductor...

1129
Authors: Yuan Lin Wen, M.D. Jeng, Yi Sheng Huang
1135

Showing 181 to 190 of 220 Paper Titles