Materials Science Forum Vols. 544-545

Abstract: Pt/PZT/PbO/Si with the MFIS structure was deposited on the p-type (100) Si substrate by the r.f. magnetron sputtering method with Pb1.1Zr0.53Ti0.47O3 and PbO targets. From the X-ray photoelectron spectroscopy (XPS) results, we could confirm that the partial pressure ratio during PbO deposition affects the interface condition of PbO/Si and the chemical state of Pb existing at the surface of the PZT thin film. The maximum value of the memory window is 3.0 V under the applied voltage of 9V for Pt/PZT (200 nm 400°C)/PbO (80 nm, 300°C)/Si structures with the PbO buffer layer deposited at the partial pressure of 7:3. From these results, we could assume that the PbO buffer layers play a role of the diffusion barrier between the PZT thin film and the Si substrate as well as the seed layer.

Abstract: Electrochromic WO3 thin film was prepared by using tungsten metal solution in hydrogen peroxide as a starting solution and by a sol-gel dip coating method. The thermal analysis was conducted by DSC/TG method. A DSC/TG analysis and the XRD patterns showed that a tungsten oxide crystal phase was formed at 400oC. WO3 thin film when heat-treated at 300oC was amorphous and had a better electrochemical property than that of the crystalline phase. Crystallization of tungsten oxide decreased active sites of ion intercalation so that the current density decreased with heat-treatment temperature.