High Temperature RTP Application in SOI Manufacturing
Significant performance enhancements are offered by silicon on insulator (SOI) or strained silicon, SOI being adopted for advanced devices in sustaining Moore’s law. Sub-45 nm device options are including fully depleted (FD) devices, that are stressing even more specifications for thickness uniformity. Nano-uniformity, considering thickness variation contributions from device level to wafer scale, has been introduced in substrate optimization and latest Unibond products are verifying FD requirements. Rapid Thermal Processing (RTP) based surface smoothing has been introduced in Unibond processing to combine thickness control and product quality requirements.
W. Lerch and J. Niess
C. Maleville et al., "High Temperature RTP Application in SOI Manufacturing", Materials Science Forum, Vols. 573-574, pp. 61-74, 2008