HCl Etching Behavior on Low-Tilt-Angle and Step-Free 4H-SiC Surfaces

Abstract:

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We report on new observations made, when 4H-SiC, Si-face substrate mesas, having either low tilt-angle (< 1°) with steps or step-free top surfaces, were exposed to three separate HCl etching conditions for five minutes at temperatures of 1130°C, 1240°C and 1390°C. We observed that HCl was ineffective at 1130°C, as etching was incomplete with abundant surface contamination. At 1240°C, screw dislocations were aggressively etched by HCl, while multiple shallow flat-bottomed etch pits were formed on step-free mesa surfaces. At 1390°C, step-flow etching dominated as large etch pits were formed at screw dislocations and previously step-free surfaces etched inward from mesa edges to form parallel rows of organized steps.

Info:

Periodical:

Materials Science Forum (Volumes 615-617)

Edited by:

Amador Pérez-Tomás, Philippe Godignon, Miquel Vellvehí and Pierre Brosselard

Pages:

593-596

DOI:

10.4028/www.scientific.net/MSF.615-617.593

Citation:

A. J. Trunek et al., "HCl Etching Behavior on Low-Tilt-Angle and Step-Free 4H-SiC Surfaces", Materials Science Forum, Vols. 615-617, pp. 593-596, 2009

Online since:

March 2009

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Price:

$35.00

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