Aluminum Doping by Low-Temperature Homoepitaxial Growth for Ni Ohmic Contacts to p-Type 4H-SiC

Abstract:

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Low-temperature halo-carbon homoepitaxial growth is suitable for selective epitaxial growth of 4H-SiC using SiO2 mask. A possibility of achieving high values of doping in combination with the selective growth makes it an alternative to ion implantation for selective doping in SiC. In this work, TMA doping in situ during a blanket low-temperature epitaxial growth was utilized to produce heavily Al doped SiC layers for Ohmic contact formation to p-type SiC. Nearly featureless epilayer morphology with Al atomic concentration exceeding 3x1020 cm-3 was obtained after growth at 13000C with the growth rate of 1.5 µm/hr. Ni TLM contacts with a thin adhesion layer of Ti were formed. The as-deposited metal contacts were almost completely Ohmic even before annealing. The specific contact resistance of 2x10-2 Ohm-cm2 and 6x10-5 Ohms-cm2 was achieved without and with contact annealing respectively. The resistivity of the epitaxial layers better than 0.01 Ohm cm was measured for Al atomic concentration of 2.7x1020 cm-3.

Info:

Periodical:

Materials Science Forum (Volumes 615-617)

Edited by:

Amador Pérez-Tomás, Philippe Godignon, Miquel Vellvehí and Pierre Brosselard

Pages:

581-584

DOI:

10.4028/www.scientific.net/MSF.615-617.581

Citation:

B. Krishnan et al., "Aluminum Doping by Low-Temperature Homoepitaxial Growth for Ni Ohmic Contacts to p-Type 4H-SiC", Materials Science Forum, Vols. 615-617, pp. 581-584, 2009

Online since:

March 2009

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Price:

$35.00

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