A Molded Package Optimized for High Voltage SiC-Devices

Karl Otto Dohnke; Wolfgang Bartsch; Reinhold Schörner; T. Van Weelden

doi:10.4028/www.scientific.net/MSF.679-680.762

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HomeMaterials Science ForumMaterials Science Forum Vols. 679-680A Molded Package Optimized for High Voltage...

A Molded Package Optimized for High Voltage SiC-Devices

Abstract:

We present first results on power cycling of 6.5 kV SiC PiN-diodes mounted into a molded package. The geometry of this lateral package was designed to fulfill the specifications of the electrical isolation and the creepage distances in the high voltage region of 6.5 kV. To evaluate the suitability of this package we used high voltage SiC PiN-diodes. The diodes were soldered onto a copper lead frame, wire bonded and covered by molding compound. The packaged diodes were characterized by electrical measurements before and during a power cycling test with a temperature swing of 90 K. These results showed long term stable behavior of the I-V characteristics of the diodes as well as the suitability of the package for high temperature and high voltage application of SiC devices.

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Periodical:

Materials Science Forum (Volumes 679-680)

Pages:

762-765

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.679-680.762

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Online since:

March 2011

Authors:

Karl Otto Dohnke, Wolfgang Bartsch, Reinhold Schörner, T. Van Weelden

Keywords:

High Voltage (HV), Power Cycling, SiC PiN Diode, Transfer Molded Package

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References

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