Hall Effect Characterization of 4H-SiC MOSFETs: Influence of Nitrogen Channel Implantation

Article Preview

Abstract:

Effect of a shallow nitrogen implantation in the channel region of n-channel 4H-SiC Hall bar MOSFETs on their electrical properties has been characterized by Hall effect. A significant improvement of Hall mobility in normally-off devices is observed with increasing nitrogen implantation dose up to 1013 cm-2 with a peak Hall mobility of 42.4 cm2.V-1.s-1. Coulomb scattering as dominant scattering mechanism up to room temperature is demonstrated using temperature dependent MOS-Hall effect characterization.

You might also be interested in these eBooks

Info:

Periodical:

Materials Science Forum (Volumes 740-742)

Pages:

525-528

Citation:

Online since:

January 2013

Export:

Price:

Permissions CCC:

Permissions PLS:

Сopyright:

© 2013 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

[1] S. Haney, J. Elec. Mater 37 (2008) 646-654.

Google Scholar

[2] S. Potbhare, N. Goldsman, G. Pennington, A. Lelis, J. M. McGarrity, J. Appl. Phys. 100 (2006) 044515, 1-8.

Google Scholar

[3] N. S. Saks and A.K. Agarwal, Appl. Phys. Lett. 77 (2000) 3281-3283.

Google Scholar

[4] N. Saks, Hall effect studies of electron mobility and trapping at the SiC/SiO2 interface, W.J. Choyke, H. Matsunami, and G. Pensl (Eds), Silicon Carbide – Recent Major advances, Springer, New York 2004, pp.387-410

DOI: 10.1007/978-3-642-18870-1_16

Google Scholar

[5] E. Arnold and D. Alok, IEEE Trans. Electron Devices, 48, 9 (2001) 1870-1877.

Google Scholar

[6] A. Poggi, F. Moscatelli, S. Solmi, and R. Nipoti, IEEE Trans. Electron Devices, 55, 8, (2008) 2021-2028.

DOI: 10.1109/ted.2008.926640

Google Scholar

[7] J. Rozen, A.C. Ahyi, X. Zhu, J.R. Williams, and L.C. Feldman IEEE Trans. Electron Devices, 58, 11, (2011) 3808-3811.

DOI: 10.1109/ted.2011.2164800

Google Scholar

[8] C. Strenger, V. Uhnevionak, A. Burenkov, A. J. Bauer, V. Mortet, E. Bedel-Pereira, F. Cristiano, M. Krieger and H. Ryssel "Correlation of Interface Characteristics to Electron Mobility in Channel-implanted 4H-SiC MOSFETs" submitted to ECSCRM-2012.

DOI: 10.4028/www.scientific.net/msf.740-742.537

Google Scholar

[9] C. Strenger, V. Haublein, T. Erlbacher, A.J. Bauer, H. Ryssel, A.M. Beltran, S. Schamm-Chardon, V. Mortet, E. Bedel-Pereira, M. Lefebvre, F. Cristiano, Mater. Sci. Forum 717-720 (2012) 437.

DOI: 10.4028/www.scientific.net/msf.717-720.437

Google Scholar

[10] A. Poggi, F. Moscatelli, S. Solmi, A. Armigliato, L. Belsito, R. Nipoti, J. Appl. Phys. 107 (2010) 044506.

Google Scholar

[11] K. Ueno, T. Oikawa IEEE Electron Devices lett., 20 (1999) 624.

Google Scholar

[12] S. Dhar, S.-H. Ryu, A. K. Agarwal, IEEE Transactions on Electron Devices 57 (2010) 1195

Google Scholar

[13] A. Perez-Tomas, P. Brosselard, P. Godignon, J. Millan, N. Mestres, M. R. Jennings, J. A. Covington, P. A. Mawby, J. Appl. Physics 100 (2006) 114508.

DOI: 10.1063/1.2395597

Google Scholar

[14] A. Frazzetto, F. Giannazzo, P. Fiorenza, V. Raineri, F. Roccaforte, Appl. Phys. Lett. 99 (2011) 072117.

DOI: 10.1063/1.3665121

Google Scholar

[15] C-Y Lu, J. A. Cooper, Jr., T. Tsuji, G. Chung, J. R. Williams, K. McDonald, L. C. Feldman, IEEE Transactions on Electron Devices 50 (2003) 1582.

Google Scholar