A Study of Solid State Bonding Strength of Nonferrous Metals by Using Metal Salt Generation Bonding Method

Shinji Koyama

doi:10.4028/www.scientific.net/MSF.783-786.2450

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HomeMaterials Science ForumMaterials Science Forum Vols. 783-786A Study of Solid State Bonding Strength of...

A Study of Solid State Bonding Strength of Nonferrous Metals by Using Metal Salt Generation Bonding Method

Abstract:

In recent years, an enormous pressure was put on the need to design and develop products that are compliant with the stringent environmental regulations set up various countries. Among the problems that need to be addressed is the need to design and develop environmentally friendly products that are energy efficient and easy to recycle. In this study, the effect of metal salt generation processing on the tensile strength of the bonded interface of Al/Al and Al/Cu was investigated by SEM observations of interfacial microstructures and fractured surfaces. Aluminum surfaces were modified by boiling in 5% aqueous solution of NaOH for 30 s and 98% formic acid for 60 s. Copper surface were modified by boiling 98% formic acid for 60 s. Solid-state bonding was performed at bonding temperature of 673 ~ 813 K and under a pressure of 6 MPa ( bonding time of 1.8 ks). Using metal salt generation bonding technique, the bonded joint is able to reach 0.2% proof stress at lower bonding temperature and with less deformation.

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Periodical:

Materials Science Forum (Volumes 783-786)

Pages:

2450-2455

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.783-786.2450

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Online since:

May 2014

Authors:

Shinji Koyama*

Keywords:

Aluminum (Al), Copper, Formic Acid, Metal Salt Generation Bonding, Strength

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References

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