Bimodal and Monomodal Diamond Particle Effect on the Thermal Conductivity of Diamond Particle Dispersed Al Matrix Composite Produced by SPS

Abstract:

Diamond-particle-dispersed aluminum (Al) matrix composites consisting of monomodal and bimodal diamond particles were fabricated in spark plasma sintering process, where the mixture of diamond, pure Al and Al-5mass% Si alloy powders were consolidated in liquid and solid co-existent state. Microstructures and thermal properties of the composites fabricated in such a unique way were investigated and the bimodal and monomodal diamond particle effect was evaluated on the thermal properties of the composites. The composites can be well consolidated in a temperature range between 773 K and 878 K and scanning electron microscopy detects no reaction product at the interface between the diamond particle and the Al matrix. Relative packing density of the composite containing monomodal diamond particles decreased from 99.1% to 87.4% with increasing volume fraction of diamond between 50% and 60%, whereas that of the composite containing bimodal diamond particles was higher than 99% in a volume fraction of diamond up to 65%. The thermal conductivity of the composite containing bimodal diamond particles was higher than that of the composite containing monomodal diamond particles in a volume fraction of diamond higher than 60% and the thermal conductivity of the composite containing 70 vol.% bimodal diamond particles was 578 W/mK at R.T..

• Periodical: Materials Science Forum (Volumes 783-786)
• Pages: 2462-2467
• DOI: https://doi.org/10.4028/www.scientific.net/MSF.783-786.2462
• Online since: May 2014
• Authors: Kiyoshi Mizuuchi*, Kanryu Inoue, Yasuyuki Agari, M. Sugioka, M. Tanaka, T. Takeuchi, J. Tani, M. Kawahara, Y. Makino, Mikio Ito
• Keywords: Aluminum (Al), Diamond, Metal Matrix Composite (MMC), Particle-Reinforcement, Pulsed Current, Sintering, Thermal Properties

References

[1] Stubblefield MA, Pang SS, Cundy VA.: Compos. Part B: Eng. 1996; 27: 85-93.

[2] Wang S, Qiu J.: Compos. Part B: Eng. 2010; 41: 533-6.

[3] Lorentzen T, Clarke AP, Poulsen HF, Garbe S, Graafsma H.: Compos. Part A: Appl. Sci. Manuf. 1997; 28: 667-4.

[4] Rawdanowicz TA, Godbole V, Narayan J, Sankar J, Sharma A.: Compos. Part B: Eng. 1999; 30: 657-65.

[5] Li DS, Garmestani H, Schwartz : J. Nucl. Mater. 2009; 392: 22–27.

[6] Mizuuchi K, Inoue K, Agari Y, Nagaoka T, Sugioka M, Tanaka M, Takeuchi T, Tani J, Kawahara M, Makino Y, Ito M.: Compos. Part B Eng. 2012; 43: 2012-19.

DOI: 10.1016/j.compositesb.2012.02.004

[7] Bauccio M. ASM Engineered Materials Reference Book, second ed. ASM International, Materials Park, OH, 1994; pp.181-2.

[8] Mizuuchi K, Inoue K, Agari Y, Morisada Y, Sugioka M, Tanaka M, Takeuchi T, Tani J, Kawahara M, Makino Y.: J. Jpn. Soc. Powder Metall. 2009; 56: 438-43.

DOI: 10.2497/jjspm.56.438

[9] Mizuuchi K, Inoue K, Agari Y, Morisada Y, Sugioka M, Tanaka M, Takeuchi T, Tani J, Kawahara M, Makino Y.: Compos. Part B: Eng. 2011; 42: 825-31.

DOI: 10.1016/j.compositesb.2011.01.012

[10] Furnas CC. Grading Aggregates: I. Ind. Eng. Chem. 1931; 23: 1052-58.

[11] Khalid E, Beffort O, Klotz U, Keller B, Gasser P.: Diamond and Related Mater. 2004; 13: 393-400.

DOI: 10.1016/j.diamond.2004.05.001

[12] Eucken A.: Fortchg. Gebiete Ingenieurw., B3, Forschungsheft. 1932; 16: 353-360.