Thermal Laser Separation – A Novel Dicing Technology Fulfilling the Demands of Volume Manufacturing of 4H-SiC Devices


Article Preview

One challenge for volume manufacturing of 4H-SiC devices is the state-of-the-art wafer dicing technology – the mechanical blade dicing which suffers from high tool wear and low feed rates. In this paper we discuss Thermal Laser Separation (TLS) as a novel dicing technology for large scale production of SiC devices. We compare the latest TLS experimental data resulting from fully processed 4H-SiC wafers with results obtained by mechanical dicing technology. Especially typical product relevant features like process control monitoring (PCM) structures and backside metallization, quality of diced SiC-devices as well as productivity are considered. It could be shown that with feed rates up to two orders of magnitude higher than state-of-the-art, no tool wear and high quality of diced chips, TLS has a very promising potential to fulfill the demands of volume manufacturing of 4H-SiC devices.



Materials Science Forum (Volumes 821-823)

Edited by:

Didier Chaussende and Gabriel Ferro




D. Lewke et al., "Thermal Laser Separation – A Novel Dicing Technology Fulfilling the Demands of Volume Manufacturing of 4H-SiC Devices", Materials Science Forum, Vols. 821-823, pp. 528-532, 2015

Online since:

June 2015




* - Corresponding Author

[1] Yole Développement: SiC Market 2013 – Displacement of silicon has already begun…, (2013).

[2] Y. Goldberg et al.: Properties of Advanced Semiconductor Materials GaN, AlN, SiC, BN, SiC, SiGe,; John Wiley & Sons; New York, pp.93-148, (2001).

[3] H. -U. Zühlke: Thermal laser separation for wafer dicing,; Solid State Technology, Volume 52, Issue 5, (2009).

[4] D. Lewke et al.: High quality and high speed cutting of 4H-SiC JFET wafers including PCM structures by using Thermal Laser Separation,; MRS Proceedings, Volume 1693, (2014).

DOI: 10.1557/opl.2014.566

[5] D. Hull: Fractography: Observing, Measuring and Interpreting Fracture Surface Topography,; Cambridge University Press, pp. 91ff 263ff, (1999).

Fetching data from Crossref.
This may take some time to load.