Preface
A Modified Vacuum Packaging Technology for the Conductive Slip-Ring Encapsulating with Epoxy Molding Compounds
p.3
p.3
Experimental Study on Repairing Large Modulus Rack Cracks by Argon Arc Welding
p.8
p.8
Research on Micro-Size Electrical Discharge Machining Polycrystalline Diamond
p.14
p.14
Effect of Laser Shock Peening on Surface Residual Stress and Plastically Affected Depth of TC11 Titanium Alloy
p.20
p.20
Improved Workability of Diameter-Enlarged Process for S35C through Quenching and Tempering Heat Treatment
p.26
p.26
Influence of Fillet Radius of Die End on Workability of Diameter-Enlarged Process
p.34
p.34
Study on Wrinkles during Rotary-Draw Bending Forming
p.43
p.43
The Pouring Process Optimization for the Conductive Slip-Rin
p.48
p.48
Preface
Abstract:
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Info:
Periodical:
Materials Science Forum (Volume 943)
Online since:
January 2019
Сopyright:
© 2019 Trans Tech Publications Ltd. All Rights Reserved
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