A Modified Vacuum Packaging Technology for the Conductive Slip-Ring Encapsulating with Epoxy Molding Compounds

Bin Hong; Zhen Dong Gao; Jian Ye Gao; Ya Ji; Shun Ya Lv

doi:10.4028/www.scientific.net/MSF.943.3

Paper Titles

Preface

A Modified Vacuum Packaging Technology for the Conductive Slip-Ring Encapsulating with Epoxy Molding Compounds
p.3

Experimental Study on Repairing Large Modulus Rack Cracks by Argon Arc Welding
p.8

Research on Micro-Size Electrical Discharge Machining Polycrystalline Diamond
p.14

Effect of Laser Shock Peening on Surface Residual Stress and Plastically Affected Depth of TC11 Titanium Alloy
p.20

Improved Workability of Diameter-Enlarged Process for S35C through Quenching and Tempering Heat Treatment
p.26

Influence of Fillet Radius of Die End on Workability of Diameter-Enlarged Process
p.34

Study on Wrinkles during Rotary-Draw Bending Forming
p.43

The Pouring Process Optimization for the Conductive Slip-Rin
p.48

HomeMaterials Science ForumMaterials Science Forum Vol. 943A Modified Vacuum Packaging Technology for the...

A Modified Vacuum Packaging Technology for the Conductive Slip-Ring Encapsulating with Epoxy Molding Compounds

Abstract:

Due to its specific structural features, the packaging technology is quite essential for the conductive slip-ring (CSR) encapsulating with epoxy molding compounds (EMC). In this work, a modified vacuum packaging technology has been proposed which includes a pouring process and a followed soaking process. Based on the experimental results; the reliability of the CSR packaged obtains a significant improvement as its thermal stability and electric insulating property are obviously advanced, comparing with that fabricated by the normal vacuum packaging method.

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Periodical:

Materials Science Forum (Volume 943)

Pages:

3-7

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.943.3

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Online since:

January 2019

Authors:

Bin Hong*, Zhen Dong Gao, Jian Ye Gao, Ya Ji, Shun Ya Lv

Keywords:

Conductive Slip-Ring, Epoxy Molding Compounds, Packaging Technology, Pouring Model, Soaking Model

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