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Effects of Aluminum Incorporation on the Young’s Modulus of 3C-SiC Epilayers
Abstract:
The silicon carbide cubic polytype (3C-SiC) is a material of choice to fabricate microelectromechanical systems. However, the mechanical properties of 3C-SiC-based devices are severely linked to the stress of the involved 3C-SiC material. Moreover, the stress level can hamper completing microsystems. As a consequence, in this study, we considered the influence of aluminum (Al) doping towards the mechanical properties of 3C-SiC epilayers and demonstrated a noticeable reduction of the Young’s modulus with a high Al incorporation.
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305-308
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Online since:
July 2019
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© 2019 Trans Tech Publications Ltd. All Rights Reserved
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