Ultrasonic Preparation of Submicron Low Melting Point Alloy Powder

Abstract:

In order to study the preparation of low-melting alloy powder in phase change materials, three sets of control experiments were set up in this paper. To explore the effects of ultrasonic oscillation, ultrasonic atomization technology and rapid cooling had an effect on the particle size, surface morphology and powder shape of ultrasonic powder making. In the experiment, ultrasonic atomization, rapidly cooling ultrasonic atomization, and ultrasonic vibration generated powder were tested. The results showed that the surface of fog droplets generated by ultrasonic atomization was smooth, with distinct particles. The powder diameter was large, ranging from 20-60 μm. The surface of the powder obtained by ultrasonic shock existed an aggregation phenomenon. The powder diameter was small ranging from 5-10 μm. The ultrasonic atomized powder obtained by rapid cooling was mostly spherical with a smooth surface. After the screening, spherical powder with a diameter of 15-25 μm and the smooth surface could be obtained. The results showed that the particle diameter is small and uniform, while the uneven surface was difficult to eliminate. The experimental conditions of rapid cooling were favorable for the smoothness of the particle surface and the roundness of powder shape. Spherical powder with a diameter of 15-25 μm can be obtained by screening the rapidly cooled powder after ultrasonic atomization. Different experimental conditions and technological approach can produce high-performance low melting point alloy powder.

• Periodical: Materials Science Forum (Volume 993)
• Pages: 333-343
• DOI: https://doi.org/10.4028/www.scientific.net/MSF.993.333
• Online since: May 2020
• Authors: Qing Qing Shu, Jing Tao Shi, Jing Liu, Zhong Shan Deng*
• Keywords: Alloy Cooling, Low Melting Point, Phase Change Material, Ultrasonic

References

[1] Zhou Liangzhi. Microelectronics Device Packaging: Packaging Materials and Packaging Technology, M. Chemical Industry Press (2006).

[2] Tian Zengying (Eds.). Miao He Zhuo. Knowledge from the West Precision Ceramics and Applications M. Science Popularization Press (1993).

[3] Roy C K, Bhavnani S, Hamilton M C, et al. Thermal performance of low melting temperature alloys at the interface between dissimilar materials, J. Applied Thermal Engineering. 99 (2016) 72-79.

DOI: 10.1016/j.applthermaleng.2016.01.036

[4] Qiao Liang. Study on Low Temperature Sintering Mechanism of Aluminum Nitride Ceramic. Beijing Department of Materials Engineering Tsinghua University (2002).

[5] Guo Zengyuan. The Frontier of International Heat Transfer Research--Microscale Heat Transfer, J. Advances in Mechanics .30(1) (1900) 1-6.

[6] Zhang Jinguo. Multi-chip component technology in the 1990s, J. Electronic Components & Materials. 5 (1993) 58.

[7] Webb R L, Gwinn J P. Low melting point thermal interface material, J. (2002) 671-676.

[8] Macris C G, Sanderson T R, Ebel R G, et al. Performance, Reliability, and Approaches Using a Low Melt Alloy as a Thermal Interface Material[C].37th international symposium on microelectronics, 2004, pp.14-18.

[9] Roy C K, Bhavnani S, Hamilton M C, et al. Investigation into the application of low melting temperature alloys as wet thermal interface materials, J. International Journal of Heat & Mass Transfer. 85(1) (2015) 996-1002.

DOI: 10.1016/j.ijheatmasstransfer.2015.02.029

[10] Martin Y, Kessel T V. High performance liquid metal thermal interface for large volume production[J]. Ibm Corporation, (2007).

[11] Yang E, Guo H, Guo J, et al. Thermal Performance of Low-Melting-Temperature Alloy Thermal Interface Materials, J. Acta Metallurgica Sinica. 27(2) (2014) 290-294.

DOI: 10.1007/s40195-014-0042-6

[12] Hill R F, Strader J L. Practical utilization of low melting alloy thermal interface materials[C]// IEEE. IEEE Xplore, 2006, pp.23-27.

DOI: 10.1109/stherm.2006.1625201

[13] Liu Jing Zhou Xin. A New Field of Chip Enhanced Heat Dissipation——Proposal and Development of Low Melting Point Liquid Metal Heat Dissipation Technology, J. Electromechanical Engineering. 22(6) (2006) 9-12.

[14] Liu Jing Zhou Xin. Heat dissipation device for chip heat dissipation using low melting point metal or its alloy as flow medium, China. Patent 02131419.5 (2002).

[15] Li Teng Liu Jing. Research Progress of Micro/Nano Materials and Structures in Chip Cooling TechnologyJ. Micro-nano-electronic Technology. 41(8) (2004) 21-27.

[16] Li Teng Lü Yonggang Liu Jing et al. Computer chip heat dissipation method based on low melting point metals and their alloys C. China Society of Engineering Thermophysics 2004 Heat and Mass Transfer Conference, (2004).

[17] Liu J, Deng Y G, Deng Z S. Recent Advancement on Liquid Metal Cooling for Thermal Management of Computer Chip[C].ASME 2010 International Mechanical Engineering Congress and Exposition. 2010, pp.161-166.

DOI: 10.1115/imece2010-37640

[18] Deng Y, Liu J. Design of Practical Liquid Metal Cooling Device for Heat Dissipation of High Performance CPUs, J. Journal of Electronic Packaging. 132(3) (2010) 031009.

DOI: 10.1115/1.4002012

[19] Ge H, Li H, Mei S, et al. Low melting point liquid metal as a new class of phase change material: An emerging frontier in energy area, J. Renewable & Sustainable Energy Reviews. 21(5) (2013) 331-346.

DOI: 10.1016/j.rser.2013.01.008

[20] Shen Guoyong. Properties Uses and Development of Low Melting Alloys, J. Mechanical Engineering Materials. 4 (1981) 30-34.

[21] Luan Jishen, Hu Xiaoyan. Study on Improving the Properties of Bi-Sn Low Melting Alloys, J. Mold Technology. 1 (1985) 34-38.

[22] Wang Jihui,Yang Yaqun, LI Qunying et al. Design and properties of Bi-Sn-In temperature-controlled fusible alloys, J. Chinese Journal of Nonferrous Metals.16(10) (2016) 1653-1659.

[23] Ni Jun. Preparation and properties of low melting point metal thermal interface materials. Shandong Qingdao University of Science and Technology (2017).

[24] Shao Meiqi. Preparation of ultrafine nano-powder by ultrasonic atomization D. Jiangsu University (2008).

[25] Zhang jishan, Xiong boqing, Cui hua, Spray Forming Rapid Solidification Technology: Principles and Applications, Beijin, (2008).

[26] Robert C. Handbook of Chemical and Physics. Ohio: CRC Press, (1978).

[27] Unal A. Mat. Sci. Tech. 4 (1988) 909.

[28] Lawley A. Int. J. Powder Met. 13 (1977) 169.

[29] Zhang Shuguang Yang Bicheng Yang Bo et al. Preparation of spherical metal powder by a new ultrasonic atomization technique, J. Acta Metall Sinica. 38(8) (2002) 888892.

[30] Pandey O P. Journal of Materials Science and Technology. 14(2) (1998) 125-131.

[31] Sun Xiaoxia. Research progress of ultrasonic atomizing nozzle, J. Industrial furnace. 26 (1) (2004) (1923).

[32] Zhang XD, Yang XH, Zhou YX, et al., Experimental investigation of galinstan based minichannel cooling for high heat flux and large heat power thermal management, Energ Convers Manage. 185 (2018) 248-258.

DOI: 10.1016/j.enconman.2019.02.010