Paper Titles

Purification of Trace Amount of Metal Impurity from Ultra Pure Water Using Membrane Purifier/Filter
p.265

Metal Contamination on Silicon Surfaces from Solvents
p.269

Adhesion and Removal of Alumina Slurry Particles on Wafer Surfaces in Cu CMP
p.275

A Force Study in Brush Scrubbing
p.279

Dissolution Characteristics of Ceria in Ascorbic Acid Solutions with Implications to Cleaning
p.283

Investigation of Dissolution and Electrodeposition of Copper in Concentrated and Diluted Oxalic Acid Media in Post-CMP Cleaning
p.287

Non-Contact Cleaning Process for Post-CMP Copper
p.291

Novel Photo Resist Stripping for Single Wafer Process
p.297

Resist Stripping for Advanced FEOL Nodes: Improvements to Process Based on Ozone Diffusion by Use of Additives
p.301

HomeSolid State PhenomenaSolid State Phenomena Vols. 103-104Dissolution Characteristics of Ceria in Ascorbic...

Dissolution Characteristics of Ceria in Ascorbic Acid Solutions with Implications to Cleaning

Article Preview

Abstract:

You might also be interested in these eBooks

Ultra Clean Processing of Silicon Surfaces VII

Info:

Periodical:

Solid State Phenomena (Volumes 103-104)

Pages:

283-286

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.103-104.283

Citation:

Cite this paper

Online since:

April 2005

Authors:

S. Tamilmani, V. Lowalekar, Srini Raghavan, Robert Small

Keywords:

Ascorbic Acid, Ceria Particles, Post CMP Cleaning, STI CMP

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

© 2005 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation: