Resist Stripping for Advanced FEOL Nodes: Improvements to Process Based on Ozone Diffusion by Use of Additives

Olivier Louveau; Emile Lajoinie; Olivier Pollet; Jean Philippe Odet; Sylviane Cêtre; Laurent Lachal; Béatrice Icard; Evelyne Tabouret; Marc Veillerot; Hervé Fontaine; Didier Louis

doi:10.4028/www.scientific.net/SSP.103-104.301

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Dissolution Characteristics of Ceria in Ascorbic Acid Solutions with Implications to Cleaning
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Investigation of Dissolution and Electrodeposition of Copper in Concentrated and Diluted Oxalic Acid Media in Post-CMP Cleaning
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Non-Contact Cleaning Process for Post-CMP Copper
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Novel Photo Resist Stripping for Single Wafer Process
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Resist Stripping for Advanced FEOL Nodes: Improvements to Process Based on Ozone Diffusion by Use of Additives
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Cleaning Capability of High Concentration Ozonated Water
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Photoresist Stripping by Ozone/Water Processes: Effect of Additives
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Resist Stripping for Advanced FEOL Nodes: Improvements to Process Based on Ozone Diffusion by Use of Additives

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Periodical:

Solid State Phenomena (Volumes 103-104)

Pages:

301-304

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.103-104.301

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Online since:

April 2005

Authors:

Olivier Louveau, Emile Lajoinie, Olivier Pollet, Jean Philippe Odet, Sylviane Cêtre, Laurent Lachal, Béatrice Icard, Evelyne Tabouret, Marc Veillerot, Hervé Fontaine, Didier Louis

Keywords:

Additive, FEOL, Ozone Process, Residue Removal, Resist Stripping

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References

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