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HomeSolid State PhenomenaSolid State Phenomena Vols. 103-104Non-Contact Cleaning Process for Post-CMP Copper

Non-Contact Cleaning Process for Post-CMP Copper

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Periodical:

Solid State Phenomena (Volumes 103-104)

Pages:

291-296

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.103-104.291

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Online since:

April 2005

Authors:

Daniel A. Koos, Julia Svirchevski, Daniel J. Vitkavage, David G. Hansen, Karen A. Reinhardt, Frank Huang, Marie Mitchel, Guang Ying Zhang

Keywords:

Cleaning, Copper CMP, Megasonic, Post CMP

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© 2005 Trans Tech Publications Ltd. All Rights Reserved

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Citation:

[1] SIA International Technology Roadmap for Semiconductors, 2002 Edition, p.212.

[2] S. Banerjee, A. Via Joshi, J. Eklund S. Banerjee, A. Via, S. Joshi, and J. Eklund, 204th ECS Meeting, 2003.

[3] F. Zhang, A. Busnaina, M. Fury, S. Wang, Journal Of Electronic Materials, Feb., 2000,pp.1-22