Photoresist Stripping by Ozone/Water Processes: Effect of Additives

Abstract:

• Periodical: Solid State Phenomena (Volumes 103-104)
• Pages: 309-314
• DOI: https://doi.org/10.4028/www.scientific.net/SSP.103-104.309
• Online since: April 2005
• Authors: H. Vankerckhoven, F. De Smedt, K. Vandersmissen, Martine Claes, Stefan De Gendt, Marc Heyns, Chris Vinckier
• Keywords: Additive, Ozone, Photoresist, Water

References

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[6] H. Vankerckhoven, F. De Smedt, M. Claes, S. De Gendt, M. Heyns, and C. Vinckier, Solid State Phenomena 92, 101 (2003).

DOI: 10.4028/www.scientific.net/ssp.92.101

[7] H. Vankerckhoven, Ph. D. thesis, K.U. Leuven, 2004. 0,00 50,00 100,00 150,00 200,00 250,00 9 9,5 10 10,5 11 11,5 12 pH P R S t r i p R a t e ( n m / m i n ) 0,01 M H O 2 2 0,0001 M H O 2 2 No H O 2 2 Figure 1: PR strip rate (nm/min) as a function of pH (TMAH) and H2O2 concentration (M) 0,00 50,00 100,00 150,00 200,00 8,00 9,00 10,00 11,00 12,00 pH PR Strip Rate (nm/min) No t-butanol 0,01 M t-butanol Figure 2: PR strip rate (nm/min) as a function of pH (TMAH) and t-butanol addition (0.01 M) 0,00 10,00 20,00 30,00 40,00 50,000,8 1 1,2 pH PR Strip Rate (nm/min) No Additive Acetic Acid H O2 2 IPA H PO3 4 T-butanol Phenol Figure 3: PR strip rate (nm/min) as a function of various additives (0.01 M) at acidic pH (HNO3)

DOI: 10.7717/peerj.10041/table-2