Supercritical CO2 Applications in BEOL Cleaning

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Solid State Phenomena (Volumes 103-104)

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315-322

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April 2005

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© 2005 Trans Tech Publications Ltd. All Rights Reserved

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[1] G. Levitin, S. Myneni, D.W. Hess: Electrochemical and Solid-State Letters 6 (2003), p G101-4, G. Levitin, S. Myneni, D.W. Hess, Cleaning Technology in Semiconductor Device Manufacturing, The Electrochemical Society Proceedings 26, (2003) pp.263-270.

DOI: 10.1149/1.1583372

Google Scholar

[2] R.B. Turkot Jr., V.S. RamachandraRao, S.A. Iyer, S.C. Clark: Electrochemical Society Proceedings, v 25, Cleaning Technology in Semiconductor Device Manufacturing VII - Proceedings of the International Symposium 2003, pp.254-262.

Google Scholar

[3] A. Sehgal, M.R. Yalamanchili, C. Millet, A. Danel, F. Tardif: Diffusion and Defect Data Pt.B: Solid State Phenomena 92 (2003), pp.301-304.

DOI: 10.4028/www.scientific.net/ssp.92.301

Google Scholar

[4] J.M. Blackburn, D.L. Long, A. Cabanas, J.J. Watkins: Science 294 (2001), p.141.

Google Scholar

[5] T. Rajagopalan, B. Lahlouh, J.A. Lubguban, S. Gangopadhyay, J. Sun, D.H. Huang, S.L. Simon, A. Mallikarjunan, H.-C. Kim, W. Volksen, M.F. Toney, E. Huang, P.M. Rice, E. Delenia, R.D. Miller: App. Phys. Lett. 82 (2003) pp.4328-4330.

DOI: 10.1063/1.1583139

Google Scholar

[6] R.F. Reidy, B.P. Gorman, R.A. Orozco-Teran, Zhengping Zhang, Shelley Chang, D.W. Mueller: Advanced Metallization Conference, ed. B.M. Melnick, T.S. Cale, S. Zaima, T. Ohta 2002. pp.607-612..

Google Scholar

[7] A. Danel, C. Millet, V. Perrut, J. Daviot, V, Jousseaume, O. Louveau, D. Louis: 2003 IEEE International Interconnect Technology Conference 2003, pp.248-250.

DOI: 10.1109/iitc.2003.1219767

Google Scholar

[8] B.P. Gorman, R.A. Orozco-Teran, Z. Zhang, P.D. Matz, D.W. Mueller, R.F. Reidy: Journal of Vacuum Science and Technology B 22 (2004) pp.1210-1212.

Google Scholar

[9] B. Xie, M.J. Muscat, MRS Proceedings Vol. 812, Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics, Editors: R.J. Carter, C.S. Hau-Riege, G.M. Kloster, T.-M. Lu, S.E. Schulz, p. F1.4-1.9.

Google Scholar

[10] L.B. Rothman R.J. Robey, M.K. Ali, D.J. Mount: 13th Annual IEEE/SEMI Advanced Semiconductor Manufacturing Conference. Advancing the Science and Technology of Semiconductor Manufacturing. ASMC 2002 pp.372-5.

DOI: 10.1109/asmc.2002.1001636

Google Scholar

[11] V. Perrut, A. Danel, C. Millet, J. Daviot, M. Rignon, F. Tardif: Electrochemical Society Proceedings, v 25, Cleaning Technology in Semiconductor Device Manufacturing VII - Proceedings of the International Symposium 2003, pp.246-253.

Google Scholar

[12] R.F. Reidy, Zhengping Zhang, R.A. Orozco-Teran, B.P. Gorman, D.W. Mueller: MRS Proceedings Vol 766, Materials, Technology, and Reliability for Advanced Interconnects and Low-k Dielectrics, Editors: A. McKerrow, J. Leu, O. Kraft, T. Kikkawa 2003, E6.10.

Google Scholar

[13] http://www.lanl.gov/worldview/news/releases/archive/01-073.shtml.

Google Scholar

[14] Victor Q. Pham, Robert J. Ferris, Alyssandrea Hamad, Christopher K. Ober: Chem. Mater. 15 (2003), pp.4893-4895.

Google Scholar

[15] D. Flowers, E.N. Hoggan, R.G. Carbonell, J.M. DeSimone: Proceedings of the SPIE - The International Society for Optical Engineering, v 4690 2002, pp.419-24.

Google Scholar

[16] C.A. Jones, D. Yong, E.A. Irene, S.M. Gross, M. Wagner, J. DeYoung, J.M. DeSimone: Chem. Mater. 15 (2003), pp.2867-2869.

Google Scholar

[17] T.I. Suratwala, M.L. Hanna, E.L. Miller, P.K. Whitman. I.M. Thomas, E.R. Ehrmann, R.S. Maxwell, A.K. Burnham, J. Noncrys. Sol. 316 (2003), pp.349-363.

DOI: 10.1016/s0022-3093(02)01629-0

Google Scholar

[18] V. M. Gun'ko, M. S. Vedamuthu, G. L. Henderson and J. P. Blitz, J. Coll. Inter. Sci. 228 (2000), pp.157-170.

Google Scholar

[19] B. Xie, A.J. Muscat, Microelectronic Engineering, 76 (2004), pp.52-59.

Google Scholar

[20] R.F. Reidy, B.P. Gorman, D.W. Mueller, Z. Zhang, R. Orozco-Teran , SEMATECH Wafer Cleaning and Surface Preparation Workshop, May 2002.

Google Scholar

[21] T. Abell, K. Maex, Microelectronic Engineering, 76 (2004), pp.16-19.

Google Scholar

[22] G. Levitin, S. Myneni, D.W. Hess, J. Electrochem. Soc., 151 (2004), p.G380-G386.

Google Scholar

[23] C.A. Bessel, G.M. Denison, J.M. DeSimone, J. DeYoung, S. Gross, C.K. Schanuer, P.M. Visintin, J. Am. Chem. Soc., 125 (2003) pp.4980-4981.

Google Scholar

[24] G. Jacobson, B. Hansen, R. Kevwitch, M. Lowe, M. Najari, D. Yellowaga, M. Biberger, K. Hamamoto, D. Toma, P. Matz, T. Hurd, S. Ajmera, S.P. Rao : International Sematech Wafer Cleans and Surface Preparation Conference 2004: pp.356-368.

Google Scholar