Impact of Downstream Ash Plasmas on Ultra Low-k Materials

Nicolas Possémé; Thibaut David; P. Meininger; O. Louveau; T. Chevolleau; O. Joubert; Didier Louis

doi:10.4028/www.scientific.net/SSP.103-104.337

Paper Titles

Supercritical CO₂ Applications in BEOL Cleaning
p.315

Repair of Porous MSQ (p-MSQ) Films Using Monochlorosilanes Dissolved in Supercritical CO₂
p.323

Copper Decontamination Ability of Supercritical-CO₂/Additives on CVD and Spin-On Porous MSQ Materials
p.327

Angled XPS Analysis of Low-k Dielectric Surfaces after Cleaning
p.331

Impact of Downstream Ash Plasmas on Ultra Low-k Materials
p.337

Activated He:H₂ Strip of Photoresist over Porous Low-k Materials
p.341

Qualification of Resist Strip Process for Ultra Low-k/Cu Interconnect
p.345

Effect of Chemical Solution on the Stability of Low-k Films
p.349

Aqueous Based Single Wafer Cu/Low-k Cleaning Process Characterization and Integration into Dual Damascene Process Flow
p.353

HomeSolid State PhenomenaSolid State Phenomena Vols. 103-104Impact of Downstream Ash Plasmas on Ultra Low-k...

Impact of Downstream Ash Plasmas on Ultra Low-k Materials

Abstract:

You might also be interested in these eBooks

Ultra Clean Processing of Silicon Surfaces VII

View Preview

Info:

Periodical:

Solid State Phenomena (Volumes 103-104)

Pages:

337-340

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.103-104.337

Citation:

Cite this paper

Online since:

April 2005

Authors:

Nicolas Possémé, Thibaut David, P. Meininger, O. Louveau, T. Chevolleau, O. Joubert, Didier Louis

Keywords:

Ash, BEOL, Downstream Plasmas, Effectiveness, Porous Ultra Low-k

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

Citation:

References

[1] K. Maex et al, J. Appl. Phys., 93, (2003)

Google Scholar

[2] P. Liu et al, ECS, 5(3), G11-G14, (2002)

Google Scholar

[3] Y.S. Kim et al, proceedings of DPS, p.245, (2000)

Google Scholar

[4] A. Matsushita et al, proceedings of I.I.T.C, pp.147-152, (2003)

Google Scholar

[5] O. Louveau et al, Micr. Engineering, 73-74, (2004)

Google Scholar

[6] K G.J.H Brussaard et al, J. Vac. Sci. Technol. B, 21, Jan/Feb (2003)

Google Scholar

[7] N. Possémé et al, to be published in the proceedings of DPS, (2004)

Google Scholar