Qualification of Resist Strip Process for Ultra Low-k/Cu Interconnect

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Periodical:

Solid State Phenomena (Volumes 103-104)

Edited by:

Paul Mertens, Marc Meuris and Marc Heyns

Pages:

345-348

DOI:

10.4028/www.scientific.net/SSP.103-104.345

Citation:

H. Xu et al., "Qualification of Resist Strip Process for Ultra Low-k/Cu Interconnect", Solid State Phenomena, Vols. 103-104, pp. 345-348, 2005

Online since:

April 2005

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Price:

$35.00

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