Semi-Solid Processing of Alloys and Composites

Volumes 116-117

doi: 10.4028/

Paper Title Page

Authors: Yi Tao Yang, Heng Hua Zhang, Guang Jie Shao

Abstract: To aid the optimizing design of filling system, computer simulation technique is introduced to predict injection-forming process and to...

Authors: Byoung Soo Lee, Dae Heon Joo, Myung Ho Kim

Abstract: Melt extrusion is a new fabrication process with the characteristics of both casting and extrusion. In this process, a metallic melt which...

Authors: Hong Yan, Bing Feng Zhou

Abstract: Uniaxial compression tests on semi-solid AZ61 alloy fabricated by stain-induced activation (SIMA) process and the conventional casts were...

Authors: Wei Wei Shan, Ju Fu Jiang, Shou Jing Luo

Abstract: Thixotropy is the most important characteristic of semi-solid materials, and it is decided by the variation of microstructure during action...

Authors: Hsueh I Chen, Jyh Chen Chen

Abstract: By a high-temperature Couette type viscometer, we studied the thixotropic behavior of the semi-solid AZ91D magnesium alloy slurry....

Authors: Sang Yul Lee, Sang Yong Lee

Abstract: Filling and solidification phenomena during thixoforming of copper rotor for small sized induction motors have been analyzed and...

Authors: Soo Han Park, Yong Su Um, Bo Young Hur

Abstract: The surface tension and the viscosity characteristics of molten metal are the most important factors in casting process and metallic foam...

Authors: Ji Sen Qiao, Jian Hong Chen, Liang Zhu

Abstract: This paper uses the small punch test (SPT) to some performance of the materials, have put forward basic method to test the material tensile...

Authors: Dock Young Lee, Suk Won Kang, Ki Bae Kim

Abstract: In this study, in order to develop the cast product of Al alloy having a globular microstructure by using the elctromagnetic (EM) stirrer,...

Authors: Man Sig Kim, Eui Yeol Lee

Abstract: Current practice in designing tooling components for semisolid processing requires extensive commitments of human resources. Even when...


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