Electrical and Thermal Properties of Platinum Thin Films Prepared by DC Magnetron Sputtering for Micro-Heater of Microsensor Applications after CMP Process
Chemical mechanical polishing (CMP) of platinum thin films was performed for the improvement of surface morphology. Platinum thin films after CMP process with alumina slurry showed the increase of surface morphology without a remarkable difference of the thermal characteristics of as-annealed platinum thin films. The power consumption of platinum thin films micro-heater also became very low by improvement of surface morphology after CMP process. The similar or improved electrical and thermal characteristics of platinum thin films for micro-heater of sensor applications as well as evaluation possibility of sensing property by the improved surface morphology were obtained after CMP process.
Byung Tae Ahn, Hyeongtag Jeon, Bo Young Hur, Kibae Kim and Jong Wan Park
N. H. Kim et al., "Electrical and Thermal Properties of Platinum Thin Films Prepared by DC Magnetron Sputtering for Micro-Heater of Microsensor Applications after CMP Process", Solid State Phenomena, Vols. 124-126, pp. 267-270, 2007