Radiation Defects and Thermal Donors Introduced in Silicon by Hydrogen and Helium Implantation and Subsequent Annealing

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The effect of high-energy hydrogen and helium implantation and subsequent annealing on generation of radiation defects and shallow donors in the low-doped oxygen-rich FZ n-type silicon was investigated. Samples were implanted with 7 MeV 4He2+ or 1.8 MeV 1H+ to fluences ranging from 1x109 to 3x1011 cm-2 and 1.4x1010 to 5x1012cm-2, resp., and then isochronally annealed for 30 minutes in the temperature range up to 550°C. Results show that radiation damage produced by helium ions remarkably enhances formation of thermal donors (TDs) when annealing temperature exceeds 375°C, i.e. when the majority of vacancy-related recombination centers anneals out. The excess concentration of TDs is proportional to the helium fluence and peaks at 1.6x1014cm-3 if annealing temperature reaches 475°C. Proton irradiation itself introduces hydrogen donors (HDs) which form a Gaussian peak at the proton end-of-range. Formation and annealing of shallow and deep hydrogen-related levels are strongly influenced by electric field at annealing temperatures below 175°C. If annealing temperature exceeds 350°C, HDs disappear and the excessive shallow doping is caused, as in the case of helium irradiation, by radiation enhanced TDs.

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Periodical:

Solid State Phenomena (Volumes 131-133)

Edited by:

A. Cavallini, H. Richter, M. Kittler and S. Pizzini

Pages:

201-206

DOI:

10.4028/www.scientific.net/SSP.131-133.201

Citation:

P. Hazdra and V. V. Komarnitskyy, "Radiation Defects and Thermal Donors Introduced in Silicon by Hydrogen and Helium Implantation and Subsequent Annealing", Solid State Phenomena, Vols. 131-133, pp. 201-206, 2008

Online since:

October 2007

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$35.00

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