Effect of Various Cleaning Solutions and Brush Scrubber Kinematics on the Frictional Attributes of Post Copper CMP Cleaning Process

Abstract:

Brush scrubbing has been widely used in post chemical mechanical planarization (CMP) applications to remove contaminations, such as slurry residues and particles, from the wafer surface. During brush scrubbing, particle removal results from direct contact between a soft poly vinyl alcohol (PVA) brush and the wafer surface in which the brush asperities engulf the particles while the rotating motion of the brush, as well as the cleaning fluid at the surface, dislodge and carry the particles away from the wafer. The cleaning performance of brush scrubbing depends heavily on the choice of the cleaning solution and brush scrubber kinematics. In this work, the effect of various cleaning solutions and brush scrubber kinematics on the frictional attributes of post copper CMP cleaning process was investigated.

• Periodical: Solid State Phenomena (Volumes 145-146)
• Pages: 363-366
• DOI: https://doi.org/10.4028/www.scientific.net/SSP.145-146.363
• Online since: January 2009
• Authors: Yasa Sampurno, Yun Zhuang, Xun Gu, Sian Theng, Takenao Nemoto, Ting Sun, Fransisca Sudargho, Akinobu Teramoto, Ara Philipossian, Tadahiro Ohmi
• Keywords: Brush, Citric Acid (CA), Cleaning Process, Cleaning Solutions, Down Force, Frictional Force, Post Copper CMP, PVA, Rotational Rate, Shear Force, Slurry, Surfactant

References

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