Impact of Dry Etch and Ash Conditions on Removability of Plasma Etch Residues in Al-Metallization. Approach to Improve PER Cleaning Efficiency by EHS-Friendly Aqueous Remover

Berthold Ferstl; Andreas Klipp; Manfred Essig; Maria Heidenblut

doi:10.4028/www.scientific.net/SSP.145-146.353

Paper Titles

The Interaction of Sublimed Iminodiacetic Acid with a Cu{110} Surface
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Advances in Test Wafer Reclaim Technology – Wet Stripping Porous Low-k Films with No Substrate Damage
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Electrochemical Behavior of Cobalt in Post-Via Etch Cleaning Solutions
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Characterization of Post Etch Residues Depending on Resist Removal Processes after Aluminum Etch
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Impact of Dry Etch and Ash Conditions on Removability of Plasma Etch Residues in Al-Metallization. Approach to Improve PER Cleaning Efficiency by EHS-Friendly Aqueous Remover
p.353

Borderless via Clean Study for Minimizing Al-Cu Loss in 58nm Flash Devices
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Effect of Various Cleaning Solutions and Brush Scrubber Kinematics on the Frictional Attributes of Post Copper CMP Cleaning Process
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The Effect of PVA Brush Scrubbing on Post CMP Cleaning Process for Damascene Cu Interconnection
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Cu Surface Characterization after Wet Cleaning Processes
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Impact of Dry Etch and Ash Conditions on Removability of Plasma Etch Residues in Al-Metallization. Approach to Improve PER Cleaning Efficiency by EHS-Friendly Aqueous Remover

Abstract:

Driven by cost saving pressure and new regulations such as REACH, the imple¬mentation of cost efficient, EHS-friendly alternatives is in full swing. There is a clear trend in the plasma etch residue (PER) cleaning field to replace the currently used, expensive and harmful organic PER-removers by EHS-friendly aqueous alternatives. Striking advantages of fluorine free aqueous removal are reported1. The goals of present work -which was carried out in cooperation of BASF and Infineon-, was to examine the dependence of residue constitution on etch and strip conditions and to find a way to adapt also most critical cleaning challenges for EHS-friendly PER remover usage. For that reason a selected aluminum interconnect metal layer with difficult removable residues was chosen. XPS is well proved as an appropriate method for selective sidewall and top/bottom residue analysis2. Our analytical work was focused on defining fingerprints for the etch residues, concerning their elemental distribution, and tracking their changes during the different process steps and conditions.