Advances in Test Wafer Reclaim Technology – Wet Stripping Porous Low-k Films with No Substrate Damage

Mark Robson; Kristin A. Fletcher; Ping Jiang; Michael B. Korzenski; A. Upham; T. Haigh Jr.; Thomas J.C. Hsieh

doi:10.4028/www.scientific.net/SSP.145-146.339

Paper Titles

Modification of Photoresist by UV for Post-Etch Wet Strip Applications
p.323

Recyclable Fluorine-Based Cleaning Solvents for Resist Removal
p.327

Cu Dendrite Formation in Post Trench Etch Cleaning
p.331

The Interaction of Sublimed Iminodiacetic Acid with a Cu{110} Surface
p.335

Advances in Test Wafer Reclaim Technology – Wet Stripping Porous Low-k Films with No Substrate Damage
p.339

Electrochemical Behavior of Cobalt in Post-Via Etch Cleaning Solutions
p.343

Characterization of Post Etch Residues Depending on Resist Removal Processes after Aluminum Etch
p.349

Impact of Dry Etch and Ash Conditions on Removability of Plasma Etch Residues in Al-Metallization. Approach to Improve PER Cleaning Efficiency by EHS-Friendly Aqueous Remover
p.353

Borderless via Clean Study for Minimizing Al-Cu Loss in 58nm Flash Devices
p.357

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Advances in Test Wafer Reclaim Technology – Wet Stripping Porous Low-k Films with No Substrate Damage

Abstract:

In semiconductor processing, test wafers are used as particle monitors, film thickness monitors for deposition and oxide growth measurements, dry/wet etch rate monitors, CMP monitors, as well as characterizing new and existing equipment and processes. Depending on fab size and capacity, monthly test wafer usage can be tens of thousands or more. Due to the ever increasing demand for silicon between the IC and solar markets and the high cost of 300mm wafers, chip manufacturers are increasing their efforts to reduce overall spending on silicon - currently by far the largest non equipment related cost [1]. One approach taken by many chip makers is the concept of extending the usable life of test wafers by re-using them as many times as possible through a reclaim process.