Ultra Clean Processing of Semiconductor Surfaces IX

Volumes 145-146

doi: 10.4028/www.scientific.net/SSP.145-146

Paper Title Page

Authors: Hiroshi Tomita, Minako Inukai, Kaori Umezawa, Li Nan Ji

Abstract: It is well known that the physical force cleaning such as megasonic (MS) and ultrasonic (US) cleaning are used in FEOL (front-end-of-line)...

Authors: Aaldert Zijlstra, Tom Janssens, Kurt Wostyn, Michel Versluis, Paul W. Mertens, Detlef Lohse

Abstract: Since the introduction of megasonic cleaning in semiconductor industry a debate has been going on about which physical mechanism is...

Authors: Andrea Otto, Till Nowak, Robert Mettin, Frank Holsteyns, Alexander Lippert
Authors: Guillaume Briend, Pascal Besson, Thierry Salvetat, Sébastien Petitdidier

Abstract: More and more, 300mm manufacturing promotes a single wafer tool approach in FEOL cleaning. Previously, we reported an advanced surface...

Authors: Cole Franklin

Abstract: It has been shown that megasonics can accelerate strip processes such as doped and plasma treated photoresist [1]. However, applied...

Authors: Tom Janssens, G. Doumen, S. Halder, Kurt Wostyn, Paul W. Mertens, Joachim Straka

Abstract: A non uniform sound field distribution can be a problem in a megasonic cleaning system, since a higher sound intensity can cause damage,...


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