Ultra Clean Processing of Semiconductor Surfaces IX
Paper Title Page
Abstract: It is well known that the physical force cleaning such as megasonic (MS) and ultrasonic (US) cleaning are used in FEOL (front-end-of-line)...
Abstract: Since the introduction of megasonic cleaning in semiconductor industry a debate has been going on about which physical mechanism is...
Abstract: More and more, 300mm manufacturing promotes a single wafer tool approach in FEOL cleaning. Previously, we reported an advanced surface...
Abstract: It has been shown that megasonics can accelerate strip processes such as doped and plasma treated photoresist . However, applied...
Abstract: A non uniform sound field distribution can be a problem in a megasonic cleaning system, since a higher sound intensity can cause damage,...