Ultra Clean Processing of Semiconductor Surfaces IX

Volumes 145-146

doi: 10.4028/www.scientific.net/SSP.145-146

Paper Title Page

Authors: J.M. Goodson, R. Nagarajan
Authors: K. Xu, S. Pichler, Kurt Wostyn, G. Cado, C. Springer, Glenn W. Gale, Michael Dalmer, Paul W. Mertens, Twan Bearda, E. Gaulhofer, D. Podlesnik

Abstract: As the dimensions of the structures of integrated circuits shrink, the influence of particles on device yield becomes increasingly...

Authors: Pi Chun Yu, Cheng Kuen Chen, Jin Lang Lin, Chih Ning Wu, Hiroshi Matsuo

Abstract: In the conventional wet cleaning process of contact holes landing on the Si substrate and WSi metal gate, the ILD BPTEOS bowing and CD...

Authors: Michael T. Andreas, Kurt Wostyn, Masayuki Wada, Tom Janssens, Karine Kenis, Twan Bearda, Paul W. Mertens

Abstract: High velocity aerosol cleaning using ultrapure water or dilute aqueous solutions (e.g. dilute ammonia) is common in semiconductor IC...

Authors: Masao Watanabe, Toshiyuki Sanada, Atsushi Hayashida, Yoichi Isago

Abstract: A novel cleaning technique using steam-water mixed spray is proposed. Relatively low-pressure super-purified steam (0.1 MPa - 0.2 MPa) is...

Authors: Tae Gon Kim, Kurt Wostyn, Jin Goo Park, Paul W. Mertens, Ahmed A. Busnaina

Abstract: The removal of particles from silicon wafers without pattern damage during fabrication process is extremely important for increasing the...

Authors: Ken Finster, Robert Small, Andrea Belz, John Mahoney, Julius Perel, Jian Gong

Abstract: Conventional cleaning technologies have been effective in removal of particles, metals, and organic films. However, two trends motivating...

Authors: Kurt Wostyn, Tae Gon Kim, Paul W. Mertens, Jin Goo Park

Abstract: When a physical cleaning technology, such as megasonic and high-velocity-liquid aerosol cleaning, is considered for the removal of particles...

Authors: D. Martin Knotter, Romuald Roucou, Rémi Peyrin

Abstract: Removal of particles from substrate wafers is one of the challenges in semiconductor industry. For this end, processes and equipment are...

Authors: Faisal Wali, D. Martin Knotter, Twan Bearda, Paul W. Mertens

Abstract: In many process steps of integrated circuits (IC’s) fabrication, silicon wafers are coming in contact with process liquids such as ultra...


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