High Velocity Aerosol Cleaning with Organic Solvents: Particle Removal and Substrate Damage

Abstract:

High velocity aerosol cleaning using ultrapure water or dilute aqueous solutions (e.g. dilute ammonia) is common in semiconductor IC fabrication [1]. This process combines droplet impact forces with continuous liquid flow for improved cleaning efficiency of sub-100nm particles. As with any physically enhanced cleaning process, improved particle removal can be accompanied by increased substrate damage, especially to smaller (<80nm) features [2]. Solvents such as N-methylpyrrolidone (NMP) and tetrahydrofurfuryl alcohol (THFA) are used for resist strip applications [3]. It is possible, and sometimes useful, to deliver these solvents through the same spray nozzle normally used for aqueous spray cleaning. In this presentation we explore the particle removal and substrate damage performance of 2-ethoxyethanol (EGEE), NMP and THFA as used in a conventional aerosol spray cleaning system

• Periodical: Solid State Phenomena (Volumes 145-146)
• Pages: 39-42
• DOI: https://doi.org/10.4028/www.scientific.net/SSP.145-146.39
• Online since: January 2009
• Authors: Michael T. Andreas, Kurt Wostyn, Masayuki Wada, Tom Janssens, Karine Kenis, Twan Bearda, Paul W. Mertens
• Keywords: Aerosol Cleaning, Damage, EGEE, NMP, Particle Removal, Single Wafer Cleaning, THFA

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