High Velocity Aerosol Cleaning with Organic Solvents: Particle Removal and Substrate Damage

Abstract:

Article Preview

High velocity aerosol cleaning using ultrapure water or dilute aqueous solutions (e.g. dilute ammonia) is common in semiconductor IC fabrication [1]. This process combines droplet impact forces with continuous liquid flow for improved cleaning efficiency of sub-100nm particles. As with any physically enhanced cleaning process, improved particle removal can be accompanied by increased substrate damage, especially to smaller (<80nm) features [2]. Solvents such as N-methylpyrrolidone (NMP) and tetrahydrofurfuryl alcohol (THFA) are used for resist strip applications [3]. It is possible, and sometimes useful, to deliver these solvents through the same spray nozzle normally used for aqueous spray cleaning. In this presentation we explore the particle removal and substrate damage performance of 2-ethoxyethanol (EGEE), NMP and THFA as used in a conventional aerosol spray cleaning system

Info:

Periodical:

Solid State Phenomena (Volumes 145-146)

Edited by:

Paul Mertens, Marc Meuris and Marc Heyns

Pages:

39-42

DOI:

10.4028/www.scientific.net/SSP.145-146.39

Citation:

M. T. Andreas et al., "High Velocity Aerosol Cleaning with Organic Solvents: Particle Removal and Substrate Damage ", Solid State Phenomena, Vols. 145-146, pp. 39-42, 2009

Online since:

January 2009

Export:

Price:

$35.00

In order to see related information, you need to Login.

In order to see related information, you need to Login.