Applications of Electrostatic Spray Techniques to Surface Cleaning

Ken Finster; Robert Small; Andrea Belz; John Mahoney; Julius Perel; Jian Gong

doi:10.4028/www.scientific.net/SSP.145-146.51

Paper Titles

High Aspect Ratio Contact Clean Study in 58nm Flash Device
p.35

High Velocity Aerosol Cleaning with Organic Solvents: Particle Removal and Substrate Damage
p.39

Cleaning Technique Using High-Speed Steam-Water Mixed Spray
p.43

Pattern Collapse and Particle Removal Forces of Interest to Semiconductor Fabrication Process
p.47

Applications of Electrostatic Spray Techniques to Surface Cleaning
p.51

Analyzing the Collapse Force of Narrow Lines Measured by Lateral Force AFM Using an Analytical Mechanical Model
p.55

Reduced Particle Removal Efficiency Upon Wafer Storage
p.61

Local Distribution of Particles Deposited on Patterned Surfaces
p.65

Particle Retention Mechanism of Filter in High Temperature Chemical
p.69

HomeSolid State PhenomenaSolid State Phenomena Vols. 145-146Applications of Electrostatic Spray Techniques to...

Applications of Electrostatic Spray Techniques to Surface Cleaning

Abstract:

Conventional cleaning technologies have been effective in removal of particles, metals, and organic films. However, two trends motivating the development of new techniques are 1) the desire to minimize the environmental impact of large volumes of cleaning solutions; and 2) the need to clean at the sub-45 nm level, consistent with decreasing feature sizes. We report here on the initial characterization of a system to apply electrospray techniques to variants of the SC-1 and SC-2 solutions, as well as to solvent mixtures. We describe the generation of submicron sized droplets (<1 m radius) of cleaning mixtures and demonstrate a preliminary methodology, using a combination of experimental data and phenomenological modeling approaches, to characterize the physics of the droplet-surface interaction