Reduced Particle Removal Efficiency Upon Wafer Storage

Abstract:

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Removal of particles from substrate wafers is one of the challenges in semiconductor industry. For this end, processes and equipment are developed using particle contaminated wafers. Preparation of these wafers differs from institute to institute, which makes it difficult to compare their cleaning performance results. The difference in behavior of differently prepared particle contaminated wafers is caused by the application method it self and the subsequent storage of these wafers after the particle application.

Info:

Periodical:

Solid State Phenomena (Volumes 145-146)

Edited by:

Paul Mertens, Marc Meuris and Marc Heyns

Pages:

61-64

DOI:

10.4028/www.scientific.net/SSP.145-146.61

Citation:

D. M. Knotter et al., "Reduced Particle Removal Efficiency Upon Wafer Storage", Solid State Phenomena, Vols. 145-146, pp. 61-64, 2009

Online since:

January 2009

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Price:

$35.00

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